FTG Employees Ink New Four-Year Contract


Reading time ( words)

Firan Technology Group Corporation is pleased to announce a new contract with its represented employees at its Circuits – Toronto facility has been negotiated and ratified.

The contract is for four years, and expires in July 2022.  The contract recognizes the ongoing strong performance at that site and the commitment to continuous improvement by everyone.

“I believe the contract is well balanced with improved wages and benefits for the employees that are the direct result of the commitment by everyone to improve productivity through an ongoing focus on operational excellence,” stated Brad Bourne, president and CEO, FTG Corporation.

About Firan Technology Group Corporation

FTG is an aerospace and defense electronics product and subsystem supplier to customers around the globe. FTG has two operating units:

FTG  Circuits  is  a  manufacturer  of  high  technology,  high  reliability  printed  circuit  boards.  Our customers are leaders in the aviation, defense, and high technology industries.  FTG Circuits has operations in Toronto, Ontario, Chatsworth, California and a joint venture in Tianjin, China.

FTG Aerospace manufactures illuminated cockpit panels, keyboards and sub-assemblies for original equipment manufacturers of aerospace and defense equipment.  FTG Aerospace has operations in Toronto, Ontario, Chatsworth, California, Fort Worth, Texas and Tianjin, China.

Share


Suggested Items

Ventec's Marketing Strategy and Their Newly Appointed Technology Ambassador

12/05/2018 | Pete Starkey, I-Connect007
At electronica 2018, Mark Goodwin, chief operating officer at Ventec International Group, discusses the company’s marketing strategy along with their newly appointed technology ambassador, Alun Morgan, and how he sees the world.

Increasing Productivity for Flex Fabricators

11/14/2018 | I-Connect007 Editorial Team
Barry Matties and Nolan Johnson of I-Connect007 met with Shane Noel and industry veteran Mike Jennings of ESI to discuss the introduction of their CapStone laser tool, a product aimed at doubling their flex circuit fabricators’ throughput. Mike also shares advice for fabricators who are looking to move into the ever-growing flex market.

Substrates for Advanced PCB Technologies: What Will the Future Hold?

11/06/2018 | Pete Starkey, I-Connect007
The UK chapter of the global IMAPS community of electronics and microelectronic packaging engineers shared a wealth of knowledge and wisdom about PCB substrate technology trends, developments, and future requirements in a webinar on the first of November.



Copyright © 2018 I-Connect007. All rights reserved.