Reading time ( words)
Taiwan-based PCB makers Zhen Ding Technology and Flexium Interconnect are both gearing up to develop flexible PCBs for smartphone antennas to tap great market potentials. According to a Digitimes report, they reportedly have been reached by Apple Inc. to supply antenna FPCBs using modified PI film as an alternative material to liquid crystal polymer (LCP) involving much higher cost and harder to incorporate.
Digitimes’ sources said that another Taiwan flex PCB maker Career Technology, contracted by Apple to supply LCP antenna FPCBs for iPhones, has reportedly suffered a slow progress in producing LCB-based antenna FPCBs, driving Apple to cut orders for Career and source non-LCP FPCBs from other suppliers. Career has denied the reports, saying that the production of LCP antenna FPCBs is faring smoothly and shipments to Apple will kick off in late July as scheduled.
Barry Matties, I-Connect007
With the advent of 5G and next generation antennas, the already booming wireless infrastructure market is slated for continued growth through 2021, and as the primary material supplier for this sector, Rogers Corp. must continue to meet the technological demands of the Verizons and AT&Ts of world.
Barry Matties and Stephen Las Marias, I-Connect007
Passive intermodulation (PIM) is a circuit anomaly that has been occurring in cellular base station antennas, causing tremendous frustration and cost to antenna OEMs. As the supplier of the materials being used by these OEMs, Rogers Corp., and more specifically, Product Manager Tony Mattingly, must come up with a solution.
Dave Becker, All Flex Flexible Circuits LLC
In our world of fabricating custom electronics, a circuit can generally be defined as “a path between two or more points along which an electrical current is carried.” The printed circuit board industry designs and fabricates an incredibly diverse set of rigid and flexible circuits. But it is also true this industry produces many parts that do not carry current between discreet points.