-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
Economic Headwinds
In this issue, the biggest names in PCB manufacturing share their economic outlook for the upcoming year and beyond. As you will see, they were all bullish on our industry, but there was some apprehension as well. No one wants to get burned by another the supply chain disruption.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
MacDermid Enthone Talks Wet Processing Trends in 2018
July 24, 2018 | I-Connect007Estimated reading time: 1 minute
I-Connect007’s Patty Goldman, Barry Matties, Andy Shaughnessy, and Happy Holden were recently joined by MacDermid Enthone team members Jordan Kologe, technical marketing specialist; Ted Antonellis, applications manager for electronics specialties; and Don Cullen, marketing director for electronics solutions and MacDermid performance solutions. The discussion topic was the wet processing end of PCB manufacturing.
Patty Goldman: We’re here to talk about wet processing for PCB manufacturing. What do we need our readers to know about wet processes?
Don Cullen: We just got back from some customer roadmap sessions in China, Thailand, Taiwan, Singapore, Korea, Hong Kong. A couple of the themes that are going through my head include the transition of automotive circuitry to finally adopting HDI and microvia designs. It is kind of surprising they hadn’t really done it yet, but that seems to be happening this year. Also, there’s a big theme around circuit boards becoming more like IC substrates and IC substrates trying to emulate the cost and productivity advantages of circuit boards.
We’re all trying to marry up the technology and fine line/fine pitch metrics between wafers, IC substrates, and bare PCBs. It all affects the trends in SAP and modified SAP technology.
Barry Matties: From the applications engineer point of view, what challenges are they looking to solve that’s currently in place?
Ted Antonellis: We support a lot of different processes. I spend most of my time in bonding chemistry , the alternative oxides. People want smoother and smoother coppers for signal integrity, so there are newer processes that depend more on chemical bonding than the actual mechanical bonding to improve on that.
To read the full version of this article which originally appeared in the June 2018 issue of PCB007 Magazine, click here.
Suggested Items
Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC
03/18/2024 | IPCDevan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC as its chief strategist for advanced packaging. In this newly created role, Dr. Iyer leads IPC's work with leading electronics companies and governments to identify and deliver news solutions to IPC members and the industry.
ROCKA Solutions Expands into Brazil
03/15/2024 | ROCKA SolutionsROCKA Solutions is thrilled to announce its expansion into Brazil. With a commitment to serving the growing needs of the Brazilian electronics manufacturing market, ROCKA has established new distribution and manufacturing services in the region.
Altium to Exhibit Latest Innovations at Embedded World 2024
03/15/2024 | AltiumAltium (ASX: ALU), a global leader in electronics design systems, will be at Embedded World 2024 to reveal its latest innovations across its ecosystem, spanning Altium Designer,
Northrop Grumman Honors Suppliers for Excellence
03/14/2024 | Northrop GrummanNorthrop Grumman Corporation honored more than 70 suppliers for their outstanding contributions in 2023. In an annual recognition event, the companies included women-, minority- and veteran-owned small businesses as well as those operating in underdeveloped areas.
Indium Corporation Celebrates 90 Years of Materials Science Innovation
03/13/2024 | Indium CorporationIndium Corporation will commemorate its 90th anniversary on March 13. Indium Corporation’s innovative products, especially its advanced soldering solutions, are found in many common consumer electronics and high-reliability technologies such as electric vehicles, mobile devices, life-saving medical devices, and emerging 5G technology to name just a few.