Ventec International Group Appoints Jason Chung as CEO

Reading time ( words)

Ventec International Group Co., Ltd. announced that its Board of Directors has elected Jason Chung as group CEO with immediate effect. Chung succeeds Tony Lau who continues in his role as chairman of board of directors. 

For the time being, Chung will also continue to lead the group's Asia operations as COO for the region, alongside Mark Goodwin who is COO for Europe and the Americas. 

As one of the founding members of Ventec, Chung has played an integral role in driving the company's growth, global success and recent transformation from a privately-owned company to a publicly-listed global organization.

"Jason is an accomplished executive with a deep understanding of our business, vision, operations and the strategies we are implementing worldwide," said Tony Lau, chairman of the board of directors. "Ventec is amid a transformative phase of its impressive history, having been successfully listed and trading on the Emerging Stock Market of the Taipei Stock Exchange since 16 January 2018 and currently completing the process for a TPEx Mainboard listing for early 2019. We are confident that under Jason's leadership, Ventec is well-positioned to realize the benefits of this transformation and to build on the company's strengths, driving long-term growth and increasing shareholder value." 

"I am honored to be appointed chief executive officer of Ventec," said Chung. "As one of Ventec's original founders, I have a unique connection to the company and it is a great privilege to lead an incredible and talented global team as, together, we strive to evolve and scale to even greater heights in 2018 and beyond."

About Ventec International

With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, click here. 

Visit I-007eBooks to download your copies of Ventec International micro eBook today:  
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates

04/29/2021 | I-Connect007 Editorial Team

Mark Thompson has been in bare board fabrication for over 30 years. He is now laying out printed circuit boards at Monsoon Solutions, a high-tech design bureau near Seattle, Washington. With Mark’s extensive hands-on knowledge of PCB manufacturing, he brings a unique perspective to PCB design. In this discussion with the I-Connect007 editorial team, Mark shares what’s important from a process engineer’s point of view, and how to stay on top of evaluating and benchmarking your manufacturing process, along with insights from his new role as a designer.

04/26/2021 | Nolan Johnson, I-Connect007

Nolan Johnson speaks with Michael Gay of Isola and Chris Hunrath of Insulectro about the release of their new halogen-free, high-thermal reliability material, which they hope fills the gap in the market between epoxies and polyimides.

04/26/2021 | Pete Starkey, I-Connect007

EIPC’s seventh Technical Snapshot webinar on April 14 was timely and appropriate. In the context of current supply chain issues and material price pressures facing the PCB industry, particularly in Europe, the EIPC team brought together an outstanding group of experts—each a leading authority in his field—to analyse and comment upon the areas of concern and to respond to questions raised by a capacity audience. As Alun Morgan said, “If you don’t use the European supply chain, you won’t have it anymore!”