EIPC SpeedNews: News from the European PCB Industry


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Electronics Industry News

- 5 Popular Misconceptions About AI

News from France

- ADEX Selects Aegis Software's FactoryLogix MES Platform

News from Germany

- Schweizer Electronic AG: Preliminary Group Figures for H1 2018

- Schmid's New Etching Options Convince One of the World's Leading PCB Manufacturers

News from Israel

- Arieh Reichart Appointed to Board of Directors of PCB Technologies

News from Italy

- Seica Publishes Video About New DRAGONFLY Next > Series

News from Norway

- Elmatica Takes a Hard Line with Software

News from Taiwan

- Ventec International Group Appoints Jason Chung as CEO

News from the UK

- Important News Regarding the Candidate List of SVHCS

News from WECC Members

Click here for the International Events Diary 2018

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150+ Years of Experience: Reflections with Three Industry Icons

11/20/2018 | Barry Matties, I-Connect007
You would be hard-pressed to find a more knowledgeable and experienced group than that of Gary Ferrari, Gene Weiner, and Happy Holden. In a brief interview with Barry Matties, these three industry icons consider the past, present, and future state of electronics manufacturing while also offering advice to the newest generation of manufacturers.

Substrates for Advanced PCB Technologies: What Will the Future Hold?

11/06/2018 | Pete Starkey, I-Connect007
The UK chapter of the global IMAPS community of electronics and microelectronic packaging engineers shared a wealth of knowledge and wisdom about PCB substrate technology trends, developments, and future requirements in a webinar on the first of November.

Smartphone Substrate-Like PCBs Will Revolutionize the IC Substrate and PCB Markets

10/17/2018 | Emilie Jolivet, YOLE DÉVELOPPEMENT
The smartphone is one of the high value-add products that carries a very high demand for miniaturization. Customers expect larger screens, cameras with high resolution, and various other functions, in lighter and thinner phones.



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