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Taiwanese advance substrate manufacturer K Company has purchased an Automatic Vacuum Lamination Line from Dynachem. The latest line is a newer design that incorporate many new features.
The manufacturer, a long-time partner of Dynachem with global distribution of high-end substrate, selected the Dynachem MVC 24-S1 for their new production facility. Two systems were installed and accepted for mass production in November 2017.
MVC (modular vacuum chamber) is the new generation modular machine that provides customer an option to extend the system from single stage to dual stage lamination.
The S1 (Series 1) system uses a silicon belt as the panel introduction into the chamber. This panel transfer method helps customer save substantial amount of operational cost.
Dynachem also supplies the MVC-RTR system that is using a PET reel-to-reel for panel transfer and the MVP (Modular Vacuum Press) for dual-stage lamination.
For more information, click here.
Barry Matties, I-Connect007
With China’s recent shift towards quality, the next generation of PCB fabrication equipment must target yields and include the ability to track those yields, says Schmid’s Laurent Nicolet and Demitry Kostouros. Barry Matties recently sat down with these two gentlemen to talk more about the market shift and Schmid’s introduction of their new vertical line aimed at carving a niche in the market.
Pete Starkey, I-Connect007
The second day saw the conference room full once more, the late networking session in the bar having resulted in no significant casualties, and I was pleased to accept the invitation to moderate the first session, on processes and materials for flexible PCBs.
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