Aismalibar to Present FASTHERM at Ford Advanced Lighting Innovation Expo 2018


Reading time ( words)

Aismalibar is set to introduce their newest product offering, FASTHERM, at the Ford Advanced Lighting Innovation Expo (ALIE) show in Dearborn, Michigan on October 10-11, 2018. 

FASTHERM was developed by Aismalibar to achieve a faster thermal transition from the LED thermal pad to the heat sink. This technology allows LEDs to operate at a temperature 30°C to 50°C lower due to the direct thermal transition from the thermal pad to the heat sink. This superior thermal transition can be achieved by using the entire COBRITHERM HTC product range with either a copper or copper/aluminium base.

“We’re very excited to continue to work with FORD in automotive lighting product development. It is exciting to introduce FASTHERM at such a specialized event and we look forward to presenting our technical capabilities to all stakeholders at the expo,” says Jeff Brandman, president of Aismalibar North America.

ALIE is a unique, ground-breaking opportunity to network with top global OEMS, manufacturers, engineers, buyers and designers directly involved in new and innovative automotive lighting technology.

Aismalibar is a global leader for insulated metal substrates used in the manufacturing of automotive lighting. With strong relationships with many TIER 1 suppliers their products can be found in lighting for many vehicles manufactured around the world and are in current generation Ford, Mercedes, Audi and BMW vehicles among others.

About Aismalibar

Aismalibar was one of the first IMS laminate manufacturers in the world and was the first in Europe. Aismalibar is proud to introduce their material to the North American market in 2012. Their product IMS Cobritherm is a qualified and recognized Insulated Metal Substrate which gives the best thermal management solutions with high thermal conductivity, low thermal impedance and high dielectric capacity. AISMALIBAR has implement a 100% proof test with 1-3KV (high pot test) to all IMS laminates coming out of their plant. This is the only way to insure the dialectical strength is perfect and that production problems are detected before PCBs arrive to the end user.

Share

Print


Suggested Items

ICT 45th Annual Symposium Review

06/12/2019 | Pete Starkey, I-Connect007
The Institute of Circuit Technology (ICT) held its 45th annual symposium on June 4, 2019 in Dudley at the Black Country Museum—a symbol of the spirit of innovation in engineering technology and the entrepreneurial and manufacturing skills that had established that region’s supremacy in leading the original Industrial Revolution. Here's a recap of the events and presentations at the symposium.

DuPont on Materials Challenges and New Opportunities

06/11/2019 | I-Connect007 Editorial Team
John Andresakis, senior marketing technologist in the Interconnect Solutions (ICS) Group of DuPont, and Jonathan Weldon, RF applications engineer also in ICS at DuPont, spoke with the I-Connect007 editorial team about trends the company is seeing, what challenges their customers are facing with materials today, and future opportunities with new technologies, including 5G, electric cars, IoT, and more.

Creating Stability in Materials Chaos

06/06/2019 | Nolan Johnson, I-Connect007
Nolan Johnson and Tony Senese—manager, business development group, Panasonic EMBD—discuss the evolution of the materials marketplace over the years from a time when the market aligned for the rise of Panasonic’s MEGTRON 6 to the ever-changing materials industry of today. With the ramp-up to 5G and everyone pushing product development, Tony describes a chaotic materials market flooded with new companies and materials.



Copyright © 2019 I-Connect007. All rights reserved.