PCB Solutions Names National Essay Scholarship Winner


Reading time ( words)

PCB Solutions names the winner of the Chuan Ai Lu Engstrom Memorial Scholarship essay contest: Mathew Justis Heiner. Heiner is a social studies composite major at Utah State University and the winner of a $1000 scholarship to be used towards school tuition costs and fees. This year, PCB Solutions received a record number of submissions for the Fall 2018 essay contest. Heiner’s essay stood out as he addressed his vision of design and manufacturing in the global economy by discussing the availability, affordability, and quality of adaptive technologies for the disabled population.

The scholarship essay contest that PCB Solutions held is ongoing and they are accepting applications for the spring 2019 semester with the deadline on December 1, 2018. A winner will be announced December 15, 2018. 

PCB Solutions Vice President of Sales & Marketing, James Brown, stated, “As an electronics distribution company, we help our customers with their supply chain solutions by lowering costs and managing production through advanced inventory procurement strategies, and we are thrilled to see the impact of this scholarship as applicants are introduced to global trade and international business. We congratulate Matthew on a very well written essay that earned him this award.”

About PCB Solutions

PCB Solutions provides high-quality printed circuit board manufacturing to meet a variety of needs in the dynamic electronics industry. They provide competitive solutions for their customers with domestic and offshore capabilities for high-quality and reliable manufacturing. PCB Solutions has brought together over 50 years of custom fabrication services with a mission to continually provide unparalleled support for their customers.

For more information about the scholarship and how to enter, visit PCB Solutions' scholarship page, click here.

Share

Print


Suggested Items

RTW IPC APEX EXPO 2019: Ventec's Goodwin on Global Technology Directions

02/05/2019 | Real Time with...IPC
Mark Goodwin, Ventec International Group CEO EMEA and USA, comments on technology directions globally and in the North American market. He also explains how Ventec's quality accreditations, technical expertise, and flexible manufacturing capacity continue to strengthen their leading position.

Institute of Circuit Technology Harrogate Christmas Seminar 2018

01/02/2019 | Pete Starkey, I-Connect007
The Institute of Circuit Technology returned to the fading Victorian splendour of the palatial and stately Majestic Hotel in the North Yorkshire town of Harrogate for its 2018 Christmas seminar, an intense programme of five excellent technical presentations, impeccably organised and moderated by Technical Director Bill Wilkie and generously supported by GSPK Circuits.

Innovative PCB Processes are Lean and Green

11/29/2018 | Happy Holden, I-Connect007
Not much has changed in printed circuit multilayer manufacturing in the last 50 years except that the equipment is more mechanized and streamlined, the processes much more stable, and high-volume PCB manufacturing has moved to China.



Copyright © 2019 I-Connect007. All rights reserved.