HDP User Group Welcomes Elec & Eltek PCB as New Member

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Elec & Eltek PCB has just joined the High Density Packaging (HDP) User Group.

“All good shows crave to benefit an audience, but one-man shows don’t always make it to the box office. We at Elec & Eltek have innovative vanguard technical ideas and the talents to develop, participate and collaborate. HDP User Group is the world stage where we can perform together to make 'box office hits' for all our customers,” said Daniel Foo, Global FAE lead of Elec & Eltek.

“As a leading producer of high-tech printed circuit boards, Elec & Eltek is an excellent addition to the HDP User Group membership. The staff and members of our organization are looking forward to working with Elec & Eltek PCB on our projects and activities,” said Marshall Andrews, executive director of HDP User Group.

About Elec & Eltek PCB

Elec & Eltek operates six production sites; three in Kaiping, and one site in Guangzhou, Yangzhou, and Thailand respectively. The company also has Sales support and FAE representation in the Americas and Europe. Elec & Eltek is the highest revenue contributor to a collection of independently run PCB manufacturing companies under the umbrella of KingBoard Holdings Limited. Collectively, Kingboard ranks number 12 in revenue globally in 2017. Kingboard is the world’s largest manufacturer of Low, Mid, and High Tg Prepreg and Core laminates encompassing both non-halogen and halogen free material. Elec & Eltek has capitalized on the above to also manage a prepreg and core laminate plant in the heart of the KaiPing campus. Today, the business supports four major Industries – Network & Telecommunications (5G), Automotive (general, autonomus driving, and ADAS), Industrial Equipment (Data Storage) & Consumer electronics, and Medical. E&E is pioneering and participating in leading 5G development and support that today defines the emerging internet and wireless platform to tomorrow’s internet of all things (IOAT).

About HDP User Group

HDP User Group is a global research and development organization based in Cave Creek Arizona, is dedicated to “reducing the costs and risks for the electronics manufacturing industry when using advanced electronic packaging and assembly”. This international industry led group organizes and conducts R&D programs to address the technical issues facing the industry, including design, printed circuit board manufacturing, electronics assembly, and environmental compliance. HDP User Group maintains additional offices in Austin, Texas, and Singapore.

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