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The iNEMI Qualification Test Development for Creep Corrosion project team has developed an innovative flowers-of-sulfur (FoS) corrosion test that is inexpensive, easy to maintain and can be used to determine whether printed circuit board assemblies are likely to develop creep corrosion.
Creep corrosion is the corrosion of metallization and the migration of that corrosion across printed circuit board (PCB) surfaces. Problems arise when the corrosion migrates to such an extent that it bridges features on PCBs, causing electrical short circuits. The elimination of lead in electronics and the expansion of markets in regions such as Asia, where environments are often humid and/or have high levels of sulfur-bearing pollution, has brought corrosion-related failures to the forefront in recent years.
The test has been very successful in accurately reproducing creep corrosion on PCBs and has the potential to be used as a general-purpose corrosion chamber for material and technology development to mitigate corrosion failures.
For more information, click here.
Nolan Johnson, I-Connect007
The big news in the industry this week was the new bill introduced to the U.S. Congress in support of the PCB manufacturing industry. The Supporting American Printed Circuit Boards Act of 2022, which was introduced by Reps. Anna Eshoo (D-CA) and Blake Moore (R-UT), incentivizes “purchases of domestically produced PCBs as well as industry investments in factories, equipment, workforce training, and research and development.” The bill is a PCB-oriented complement to the semiconductor-oriented CHIPS Act of 2021.
Jordan Kologe and Leslie Kim, MacDermid Alpha Electronics Solutions
As the electronics supply chain contends with the struggles of moving out of the pandemic and into a new normal, it is increasingly obvious that a new normal will be one with sustainability and resource conservation as the top priority. Over the past year, we have seen printed circuit board manufacturers encounter challenges associated with environmental regulations, water and power outages, and pressures from the supply chain to reduce environmental footprints. From the perspective of a board fabricator, especially one that specializes in HDI, a highly resource-intensive step in the process of making a printed circuit board is the primary metallization step. All circuit boards that have multiple layers go through such a primary metallization, which is either electroless copper or direct metallization (DM).
Nolan Johnson, I-Connect007
Nolan Johnson speaks with Will Marsh, vice president of TTM Technologies and president of the Printed Circuit Board Association of America, about the work the PCBAA has been doing in Washington, D.C., to get the industry better recognized by the country’s decision-makers. Marsh is optimistic, not only about the companies and individuals joining the effort, but in the recognition by Capitol Hill to secure the nation’s defense systems.