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The iNEMI Qualification Test Development for Creep Corrosion project team has developed an innovative flowers-of-sulfur (FoS) corrosion test that is inexpensive, easy to maintain and can be used to determine whether printed circuit board assemblies are likely to develop creep corrosion.
Creep corrosion is the corrosion of metallization and the migration of that corrosion across printed circuit board (PCB) surfaces. Problems arise when the corrosion migrates to such an extent that it bridges features on PCBs, causing electrical short circuits. The elimination of lead in electronics and the expansion of markets in regions such as Asia, where environments are often humid and/or have high levels of sulfur-bearing pollution, has brought corrosion-related failures to the forefront in recent years.
The test has been very successful in accurately reproducing creep corrosion on PCBs and has the potential to be used as a general-purpose corrosion chamber for material and technology development to mitigate corrosion failures.
For more information, click here.
Nolan Johnson, I-Connect007
SpaceX is back in the news and in a big, powerful, let’s-blow-up-a-rocket-because-we-can kind of way. The company had scheduled a test launch on Monday, April 17 for the SpaceX Starship, only to scrub that launch until this past Thursday. Well, the results from the launch were less than desirable—or were they? While Starship ultimately exploded just prior to stage separation, simply clearing the launchpad was considered a major milestone by SpaceX.
Pete Starkey, I-Connect007
Widely believed to be the traditional Centre of England, Meriden was a popular venue for a gathering of the UK printed circuit community this month. They braved the forecast of heavy snow for the Institute of Circuit Technology’s annual general meeting to learn about current developments and challenges in a thought-provoking technical seminar and to network with industry peers and contemporaries. Thankfully, the forecasted heavy snowfall did not reach Meriden until after the event; we only had a few flurries, although the weather caused considerable disruption elsewhere in the country.
Matt Bergeron, Integra
Integra is one of the largest and most experienced semiconductor die prep, assembly, test, and qualification facilities in the United States, with locations in both Wichita, Kansas, and Silicon Valley. At the recent IPC Advanced Packaging Symposium, Integra was invited to present information about how we meet our customers’ specific needs.