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ABF Substrate Supply Becomes Tight
September 28, 2018 | DigitimesEstimated reading time: Less than a minute
The supply of ABF (ajinomoto build-up film) substrates has become tight, thanks to growing demand for server and high-performance computing applications, according to Digitimes.
Over the past several years, IC substrate suppliers were cautious about capacity expansion given the stagnant PC market, as well as a lack of breakthrough in server technology. However, the arrival of big data analytics has been stimulating demand for solutions, such as ABF substrates, needed for more complex IC designs.
Unimicron Technology has already seen its supply of ABF substrates fall short of demand, Digitimes reports. Unimicron's tight supply has prompted the substrate maker's major clients, such as AMD, to shift orders to other substrate suppliers including Nan Ya Printed Circuit Board (NPC) and Kinsus Interconnect Technology.
Suggested Items
The IMAPS Show: A Conversation with John Andresakis
03/26/2024 | Marcy LaRont, PCB007 MagazineOn the last day of the IMAPS Device Packaging Conference, Marcy LaRont sat down with industry veteran John Andresakis of Quantic Ohmega, who attended the conference this week. Not his first time at this event, he talked about the conference, advanced technology, and trying to get the word out about the advanced packaging substrates solution Quantic is offering.
American Made Advocacy: Going Beyond the CHIPS Act to Power American Manufacturing
03/26/2024 | Travis Kelly -- Column: American Made AdvocacyWhere have all the factories gone? A tour of America’s former bustling manufacturing communities is a stark reminder that, for the past three decades, we let the microelectronics manufacturing ecosystem disappear overseas, primarily to Asia. For decades, foreign competitors seeking to control critical markets played a long game. Government investment and subsidies were effective in undercutting U.S. and European companies. As other countries created this unfair competitive advantage in manufacturing, the know-how also migrated in their direction. This resulted in the serious workforce challenges the semiconductor and printed circuit board industries face today.
Happy’s Tech Talk #26: Balancing the Density Equation
03/14/2024 | Happy Holden -- Column: Happy’s Tech TalkPrinted circuit design and layout is a creative process that has profound implications for electronic products. With the need for more parts on an assembly, or the trend to make things smaller to be portable or for faster speeds, the design process is a challenging one. The process is one of “balancing the density equation” (Figure 1) with considerations for certain boundary conditions like electrical and thermal performance. Unfortunately, many designers do not realize that there is a mathematical process to the layout of a printed circuit
PCBAA Welcomes CHIPS Program Investing in American Made Substrates
03/05/2024 | PCBAAThe Printed Circuit Board Association of America welcomes the CHIPS for America program action to make available $300 million via a Notice of Funding Opportunity (NOFO) for domestic research and development activities to accelerate domestic capacity for advanced packaging substrates and substrate materials.
Ups and Downs in the World Market
02/29/2024 | Pete Starkey, I-Connect007The keynote session for the EIPC 2024 Winter Conference addressed several topics, ranging from applications for superconductivity to the fluctuating European financial market and the importance of IC substrates. The conference took place in late January at the IHK Academie in the city of Villingen-Schwenningen, on the eastern edge of the Black Forest in southwest Germany.