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The supply of ABF (ajinomoto build-up film) substrates has become tight, thanks to growing demand for server and high-performance computing applications, according to Digitimes.
Over the past several years, IC substrate suppliers were cautious about capacity expansion given the stagnant PC market, as well as a lack of breakthrough in server technology. However, the arrival of big data analytics has been stimulating demand for solutions, such as ABF substrates, needed for more complex IC designs.
Unimicron Technology has already seen its supply of ABF substrates fall short of demand, Digitimes reports. Unimicron's tight supply has prompted the substrate maker's major clients, such as AMD, to shift orders to other substrate suppliers including Nan Ya Printed Circuit Board (NPC) and Kinsus Interconnect Technology.
Pete Starkey, I-Connect007
The UK chapter of the global IMAPS community of electronics and microelectronic packaging engineers shared a wealth of knowledge and wisdom about PCB substrate technology trends, developments, and future requirements in a webinar on the first of November.
Emilie Jolivet, YOLE DÉVELOPPEMENT
The smartphone is one of the high value-add products that carries a very high demand for miniaturization. Customers expect larger screens, cameras with high resolution, and various other functions, in lighter and thinner phones.
George Milad, Jon Bengston and Don Gudeczauskas, UYEMURA
Nickel corrosion in ENEPIG was reproduced using exaggerated dwell time in the immersion gold bath. Nickel corrosion will occur at the manufacturing site if there is an attempt to plate thicker (>2.8 µin (0.07 µm) gold with standard immersion gold chemistry.