-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
ESI’s CapStone FPCB System Delivers Highest Via Drilling Throughput in Industry
October 8, 2018 | ESIEstimated reading time: 1 minute
Electro Scientific Industries, Inc. announced the availability of its new CapStone flexible printed circuit board laser processing system, which offers 2X throughput improvement over its predecessor for processing blind and through hole vias—the highest in the industry.
“Flexible printed circuit (FPC) manufacturers will get a significant advantage with CapStone,” said John Williams, ESI’s vice president of marketing. “Our marketing and engineering teams focused on the areas that would make the biggest impact on our customers’ productivity, pairing our newest beam control capabilities with the latest laser technology to deliver substantial gains. Doubling throughput not only enables FPC manufacturers to meet aggressive production schedules, but also allows them to add capacity with a smaller factory footprint, less capital expenditure and less recurring expense. This efficiency gain will drop right down to our customer’s bottom line.”
CapStone helps manufacturers keep pace with evolving technology requirements, such as the increasing use of blind vias and next-generation flexible materials. ESI’s new DynaClean beam positioning feature, enabled by its patented esiLens technology, reduces unproductive beam movement and provides multiple focus settings at every location. ESI’s newest-generation beam positioning technology, AcceleDrill, takes advantage of the high power and high repetition rate of the esiFlex laser to deliver unprecedented processing efficiency. Combined, these technologies allow FPC manufacturers to double their processing throughput without compromising quality, substantially lowering per-panel processing costs while maintaining high yields across a range of applications.
“The new CapStone solution leverages our extensive intellectual property portfolio and laser-material interaction expertise developed over several decades of experience in laser-based PCB processing. It expands our product offering to address important emerging applications in flex PCB manufacturing,” said Williams. “We expect the CapStone system to meet our customers’ needs well into the future.”
About ESI, Inc.
ESI’s manufacturing systems are designed to enable manufacturers of electronic components and devices to optimize their production capabilities and commercialize technologies through laser processing. ESI’s systems deliver more control, greater flexibility and more precise processing of a wider range of materials. The result is higher production quality, faster throughput, and higher yields, allowing customers to more easily meet new and challenging customer requirements, consistently meet aggressive production goals and better control costs. ESI is headquartered in Portland, Oregon, with global operations from the Pacific Northwest to the Pacific Rim. More information is available here.
Suggested Items
Absolute EMS Champions Collaboration Between Humans and Robots in Modern Manufacturing
04/19/2024 | Absolute EMS, Inc.Absolute EMS, Inc., an award-winning EMS provider of turnkey contract manufacturing services, offers a perfect factory environment that seamlessly blends robotic automation with human expertise.
Microsoft, Google Join as Sponsors for First-Ever AI Expo for National Competitiveness
04/19/2024 | SCSPThe Special Competitive Studies Project (SCSP), a non-partisan, non-profit project dedicated to strengthening America’s long-term competitiveness in artificial intelligence (AI), announced today two additional sponsors of the AI Expo for National Competitiveness.
IDTechEx Explores the Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC and AI Products
04/18/2024 | PRNewswireSemiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations
Intel Brings AI-Platform Innovation to Life at the Olympic Games
04/18/2024 | BUSINESS WIREIntel announced its plans for the Olympic and Paralympic Games Paris 2024. Bringing AI Everywhere, Intel will implement artificial intelligence technology powered by Intel processors on the world’s biggest stage.
Adura Solutions Exhibits at Del Mar 2024
04/18/2024 | Adura SolutionsSumit Tomar, CEO of Adura Solutions, has announced that his company will be exhibiting at this year's Del Mar Electronics and Manufacturing Show to be held at the Del Mar Fairgrounds, San Diego, California, April 24-25.