EIPC SpeedNews: News from the European PCB Industry

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News from Germany

- Reducing Manufacturing Costs Through Upscaling Panel Size for Copper Plating on Fan-Out Panel-Level Packaging (FO-PLP)

- Technolam Appoints Roland Schönholz as Technical Marketing Manager

- Atotech's Surface Finish Specialist Rick Nichols a Presenter and Panelist at SMTA International 2018

Electronics Industry News

- New eBook Promotes Automation and Advanced Procedures in PCB Fabrication

- Shortages & Price Hikes Leave Supply Chain in Disarray

- Analysts Foresee Supply Chain Impact from Chip Hack Report

News from Italy

- Seica Publishes Video on New Compact Slim Next> Series

News from Spain 

- Smart Systems Integration Barcelona, Spain, April 10–11, 2019

News from Switzerland 

- Dyconex to Exhibit at electronica 2018 and expoAIR

News from the UK 

- Ventec International Group's Martin Cotton Retires

- pOp 2: The 2nd International Conference on Photonics & Optoelectronics Packaging

- Polar October News - Limitless Drill Documentation / electronica

News from the USA 

- Aegis Software and Inovaxe Partner to Deliver Integrated MES and Material Handling & Storage Solution for Ultra-Lean Manufacturing

News from WECC Members 

Click here for the International Events Diary 2018

06/12/2019 | Pete Starkey, I-Connect007

The Institute of Circuit Technology (ICT) held its 45th annual symposium on June 4, 2019 in Dudley at the Black Country Museum—a symbol of the spirit of innovation in engineering technology and the entrepreneurial and manufacturing skills that had established that region’s supremacy in leading the original Industrial Revolution. Here's a recap of the events and presentations at the symposium.

05/16/2019 | I-Connect007 Editorial Team

The I-Connect007 editorial team asked Alun Morgan, technology ambassador for Ventec International Group, to discuss materials at a high level. Our conversation delivered a detailed overview of the current state of the electronics industry.

04/25/2019 | Judy Warner

Guest Editor Judy Warner met with Alun Morgan, technology ambassador for Ventec International Group, to discuss topics addressed at the Automotive Executive Forum that took place at IPC APEX EXPO 2019. Morgan describes his presentation and findings centered around thermal management in automotive, specifically LEDs, as well as the unique set of growing thermal management challenges Tier 1 suppliers are now facing in the automotive sector.