Reading time ( words)
News from Germany
- Reducing Manufacturing Costs Through Upscaling Panel Size for Copper Plating on Fan-Out Panel-Level Packaging (FO-PLP)
- Technolam Appoints Roland Schönholz as Technical Marketing Manager
- Atotech's Surface Finish Specialist Rick Nichols a Presenter and Panelist at SMTA International 2018
Electronics Industry News
- New eBook Promotes Automation and Advanced Procedures in PCB Fabrication
- Shortages & Price Hikes Leave Supply Chain in Disarray
- Analysts Foresee Supply Chain Impact from Chip Hack Report
News from Italy
- Seica Publishes Video on New Compact Slim Next> Series
News from Spain
- Smart Systems Integration Barcelona, Spain, April 10–11, 2019
News from Switzerland
- Dyconex to Exhibit at electronica 2018 and expoAIR
News from the UK
- Ventec International Group's Martin Cotton Retires
- pOp 2: The 2nd International Conference on Photonics & Optoelectronics Packaging
- Polar October News - Limitless Drill Documentation / electronica
News from the USA
- Aegis Software and Inovaxe Partner to Deliver Integrated MES and Material Handling & Storage Solution for Ultra-Lean Manufacturing
News from WECC Members
Click here for the International Events Diary 2018
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Suggested Items
09/10/2018 |
Barry Matties, I-Connect007
At the EIPC summer conference, I-Connect007 Publisher Barry Matties caught up with Ventec Europe & Americas COO Mark Goodwin, who provided an update on Ventec’s new products, the current state of the company, and how Ventec is shaking things up in the materials marketplace.
03/14/2018 |
Pete Starkey, I-Connect007
At IPC APEX EXPO recently, Pete Starkey and Ian Mayoh, Ventec International’s technical support manager, had a chance to sit down and discuss the I-Connect007 micro E-book: The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, of which Ian is a co-author.
03/13/2018 |
Real Time with...IPC
Ventec International Group’s Jack Pattie comments on continuing growth in sales, investment in manufacturing and distribution, and new product developments in polyimides, no-flow pre-pregs and thermally conductive materials.
