EIPC SpeedNews: News from the European PCB Industry

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News from Germany

- Reducing Manufacturing Costs Through Upscaling Panel Size for Copper Plating on Fan-Out Panel-Level Packaging (FO-PLP)

- Technolam Appoints Roland Schönholz as Technical Marketing Manager

- Atotech's Surface Finish Specialist Rick Nichols a Presenter and Panelist at SMTA International 2018

Electronics Industry News

- New eBook Promotes Automation and Advanced Procedures in PCB Fabrication

- Shortages & Price Hikes Leave Supply Chain in Disarray

- Analysts Foresee Supply Chain Impact from Chip Hack Report

News from Italy

- Seica Publishes Video on New Compact Slim Next> Series

News from Spain 

- Smart Systems Integration Barcelona, Spain, April 10–11, 2019

News from Switzerland 

- Dyconex to Exhibit at electronica 2018 and expoAIR

News from the UK 

- Ventec International Group's Martin Cotton Retires

- pOp 2: The 2nd International Conference on Photonics & Optoelectronics Packaging

- Polar October News - Limitless Drill Documentation / electronica

News from the USA 

- Aegis Software and Inovaxe Partner to Deliver Integrated MES and Material Handling & Storage Solution for Ultra-Lean Manufacturing

News from WECC Members 

Click here for the International Events Diary 2018

05/15/2019 | Nolan Johnson and Pete Starkey, I-Connect007

Tarja Rapala-Virtanen is the newest technical director for the EIPC. I-Connect007's Nolan Johnson and long-time EIPC conference attendee Pete Starkey discuss her new role, the upcoming summer conference in Leoben, Austria, and the program in place for the June conference.

04/03/2019 | Alun Morgan, EIPC

After the papers from the first day of the EIPC Winter Conference in Milan on February 14–15, the delegates were hosted at a reception and plant tour of Elga Europe at their nearby production facility. Here's a recap of the events and highlights of the Day 2 of the conference.

01/04/2019 | I-Connect007

Here’s a list of the top 10 most viewed FLEX007 articles in the past year.