EIPC SpeedNews: News from the European PCB Industry

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News from Germany

- Reducing Manufacturing Costs Through Upscaling Panel Size for Copper Plating on Fan-Out Panel-Level Packaging (FO-PLP)

- Technolam Appoints Roland Schönholz as Technical Marketing Manager

- Atotech's Surface Finish Specialist Rick Nichols a Presenter and Panelist at SMTA International 2018

Electronics Industry News

- New eBook Promotes Automation and Advanced Procedures in PCB Fabrication

- Shortages & Price Hikes Leave Supply Chain in Disarray

- Analysts Foresee Supply Chain Impact from Chip Hack Report

News from Italy

- Seica Publishes Video on New Compact Slim Next> Series

News from Spain 

- Smart Systems Integration Barcelona, Spain, April 10–11, 2019

News from Switzerland 

- Dyconex to Exhibit at electronica 2018 and expoAIR

News from the UK 

- Ventec International Group's Martin Cotton Retires

- pOp 2: The 2nd International Conference on Photonics & Optoelectronics Packaging

- Polar October News - Limitless Drill Documentation / electronica

News from the USA 

- Aegis Software and Inovaxe Partner to Deliver Integrated MES and Material Handling & Storage Solution for Ultra-Lean Manufacturing

News from WECC Members 

Click here for the International Events Diary 2018

01/31/2020 | Sergei Levchik, ICL-IP America

Sergei Levchik describes how testing has shown that FR-4 printed circuit boards do not contain free or residual tetrabromobisohenol-A (TBBPA).

01/29/2020 | Nolan Johnson, I-Connect007

Managing Editor Nolan Johnson recently spoke with Kristen Smit-Westerberg about the upcoming EIPC Winter Conference, February 13−14, 2020, in Rotterdam.

01/28/2020 | Barry Matties, I-Connect007

Mark Goodwin, COO of Europe and the Americas for Ventec International Group, sits down with Barry Matties to explain his approach to supply chain management, efficient distribution, and maintaining definitive product identity at every stage.