Uyemura to Exhibit and Speak at IPC APEX EXPO 2019


Reading time ( words)

Rich_DePoto.jpgUyemura will exhibit several unique technologies—each designed to meet a specific need—as board shops face unprecedented demands for thicker gold, void-free via fill and low corrosion. 

Industry experts who have been intimately involved with process development—and field engineers with extensive production experience—will be in Booth 533 for consultations and technical discussions during the 3-day conference.  

Highlights of Uyemura’s exhibit include TWX-40 a reduction-assisted immersion bath that meets the demand for gold deposits (up to 8 µin) in ENIG and ENEPIG systems while preserving electroless nickel integrity; Talon electroless/alloyed palladium phos for ENEPIG; and EVF-YF-4 via fill copper, which pattern plates uniformly, and plates through-holes and blind vias simultaneously.

Jon_Bengston.jpgRich DePoto, Uyemura manager of business development will present “Contrasting Soldering Results of ENIG and EPIG, Post Steam Aging” as part of the technical program.  Jon Bengston, manager of research and development, is the paper’s author.  ENIG, (electroless nickel immersion gold) is well-established for enhancing and preserving the solderability of copper circuits. EPIG (electroless palladium immersion gold) is a newer surface finish, also for enhancing solderability but with the advantage of a deposit layer that’s free of electroless nickel. This feature has become increasingly important with the increasing use of High Frequency PWB designs. DePoto will examine these finishes and their soldering characteristics as-plated and after steam aging, and explain the performance deviation.

Share

Print


Suggested Items

Laser Focus on Flex and Rigid-flex

01/28/2019 | Barry Matties, I-Connect007
ESI’s Chris Ryder, director of Product Management, and Shane Noel, Flex Systems product manager, discuss laser vias for flex users and the increasing necessity for companies to collaborate early on and become more and more involved, whether that be in the product design, or with the process or base material manufacturers.

Atotech at HKPCA on Announcements and Advancements

01/21/2019 | Edy Yu, I-Connect007
Edy Yu, managing editor for PCB007 China, caught up with Daniel Schmidt, Atotech’s director of global marketing, during the 2018 HKPCA and IPC Show in December. Edy and Daniel discussed Atotech’s new announcements at the show including their new solutions for 5G, high-speed, and high-frequency applications, and more.

ESI’s Chris Ryder: There’s More to Choosing a Laser Than You Think

01/16/2019 | Barry Matties, I-Connect007
At the recent HKPCA show, I sat down with ESI’s Chris Ryder, director of product management—HDI—to discuss considerations for choosing a new laser system, and how ESI uses its decades of flex and rigid-flex drilling experience to help guide customers in their decision-making process.



Copyright © 2019 I-Connect007. All rights reserved.