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Early Bird Deadline for EIPC Winter Conference Milan 2019
December 12, 2018 | EIPCEstimated reading time: Less than a minute
The early bird deadline for EIPC’s Winter Conference in Milan, Italy, on February 14–15, 2019, is fast approaching. Those who are keen to attend the event have until December 15 to take advantage of the early bird discount.
EIPC’s Winter Conference will feature familiar faces in the industry, including Walt Custer and Alun Morgan, as well as Uwe Altmann, Don Monn, Hermann Reischer, Emma Hudson and Tarja Rapala-Virtanen, delivering keynotes and presentations.
For more information on the program, click here.
To register, click here.
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The IMAPS Show: A Conversation with John Andresakis
03/26/2024 | Marcy LaRont, PCB007 MagazineOn the last day of the IMAPS Device Packaging Conference, Marcy LaRont sat down with industry veteran John Andresakis of Quantic Ohmega, who attended the conference this week. Not his first time at this event, he talked about the conference, advanced technology, and trying to get the word out about the advanced packaging substrates solution Quantic is offering.
SMTA Europe Announces 2024 Spring Conferences
03/22/2024 | SMTAThe SMTA announces three conferences taking place in Europe this spring..
IMAPS Wrap-up: AI, Chiplets, and 3D Cube Architecture
03/22/2024 | Marcy LaRont, PCB007 MagazineThe International Microelectronics Assembly and Packaging Society, IMAPS, held its 20th Device Packaging Expo and Conference this past week in Fountain Hills, Arizona, followed immediately by a ‘Workshop on Advanced Packaging for Medical Electronics’ that continued through the remainder of Thursday. Fortunate to find myself in Texas earlier in the week, I made it for the last day of the IMAPS event and attended two excellent keynote presentations by AMD and Intel, respectively. Here are some highlights.
ECWC16 Technical Conference Special Sessions
03/20/2024 | Julia Gumminger, IPCThe ECWC16 Technical Conference at IPC APEX EXPO 2024 will feature two curated Special Technical Sessions on Thursday, April 11. Building on the success of similar sessions last year, these sessions will feature leaders in the advanced packaging and e-mobility segments, focusing on technological challenges and innovations. Both sessions were curated by the Technical Program Committee (TPC), consisting of subject matter experts in their fields.