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Ventec International Group Co., Ltd. has added four new low passive intermodulation (PIM) antenna-grade laminates to its tec-speed 20.0 ceramic-filled hydrocarbon thermoset material series. These latest additions combine unrivaled high-frequency performance (Dk 3.00-3.48 / Df 0.002-0.0037), superior loss characteristics and the highest reliability with fast availability and efficient delivery through Ventec’s fully controlled and managed global supply chain and technical support-network.
No More Compromises—Performance, Price & Availability
The tec-speed 20.0 series, which is designed for the world's most demanding high frequency Printed Circuit Board applications, has now been extended with four new low PIM antenna-grade laminates: L300, L330, L340 and H348. These ceramic-filled, hydrocarbon thermoset materials offer excellent dimensional stability and uniform mechanical properties that help limit PIM.
Preserving signal integrity up to high-GHz frequencies, dielectric constant (Dk) specifications range from 3.0 to 3.48 at 10GHz and dissipation factor (Df) from 0.0025 to 0.0037 at 10 GHz giving customers a choice of the most effective material for their design. All four new materials offer first-rate processability, unrivaled RF characteristics and excellent thermal conductivity values that are ideally suited to cope with the heat generated by high-power levels. Most notable are the outstanding PIM levels of ≦-160 dBc and UL-V0 Flammability rating for the entire series.
With tec-speed 20.0, Ventec has responded to customer demands for high-performance, reliable and cost-efficient high frequency materials that are supported by a fast and efficient global delivery promise and dependable technical support.
tec-speed 20.0 ceramic-filled hydrocarbon thermoset materials are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, ISO/TS16949 and ISO 9001:2015, and, like all Ventec products, are backed by a fully controlled and managed global supply chain, sales- and technical support-network.
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The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates