Ventec Extends tec-speed 20.0 Series of Low PIM Antenna-Grade Laminates


Reading time ( words)

Ventec International Group Co., Ltd. has added four new low passive intermodulation (PIM) antenna-grade laminates to its tec-speed 20.0 ceramic-filled hydrocarbon thermoset material series. These latest additions combine unrivaled high-frequency performance (Dk 3.00-3.48 / Df 0.002-0.0037), superior loss characteristics and the highest reliability with fast availability and efficient delivery through Ventec’s fully controlled and managed global supply chain and technical support-network.

No More Compromises—Performance, Price & Availability

The tec-speed 20.0 series, which is designed for the world's most demanding high frequency Printed Circuit Board applications, has now been extended with four new low PIM antenna-grade laminates: L300, L330, L340 and H348. These ceramic-filled, hydrocarbon thermoset materials offer excellent dimensional stability and uniform mechanical properties that help limit PIM.

Preserving signal integrity up to high-GHz frequencies, dielectric constant (Dk) specifications range from 3.0 to 3.48 at 10GHz and dissipation factor (Df) from 0.0025 to 0.0037 at 10 GHz giving customers a choice of the most effective material for their design. All four new materials offer first-rate processability, unrivaled RF characteristics and excellent thermal conductivity values that are ideally suited to cope with the heat generated by high-power levels. Most notable are the outstanding PIM levels of ≦-160 dBc and UL-V0 Flammability rating for the entire series.

With tec-speed 20.0, Ventec has responded to customer demands for high-performance, reliable and cost-efficient high frequency materials that are supported by a fast and efficient global delivery promise and dependable technical support.

tec-speed 20.0 ceramic-filled hydrocarbon thermoset materials are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, ISO/TS16949 and ISO 9001:2015, and, like all Ventec products, are backed by a fully controlled and managed global supply chain, sales- and technical support-network.

Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates

Share

Print


Suggested Items

EIPC Winter Conference, Day 1

03/19/2019 | Alun Morgan, EIPC
EIPC Chairman Alun Morgan writes about the highlights of and the technical discussions at the recent EIPC Winter Conference held in Milan last February 14–15.

Laser Focus on Flex and Rigid-flex

01/28/2019 | Barry Matties, I-Connect007
ESI’s Chris Ryder, director of Product Management, and Shane Noel, Flex Systems product manager, discuss laser vias for flex users and the increasing necessity for companies to collaborate early on and become more and more involved, whether that be in the product design, or with the process or base material manufacturers.

Atotech at HKPCA on Announcements and Advancements

01/21/2019 | Edy Yu, I-Connect007
Edy Yu, managing editor for PCB007 China, caught up with Daniel Schmidt, Atotech’s director of global marketing, during the 2018 HKPCA and IPC Show in December. Edy and Daniel discussed Atotech’s new announcements at the show including their new solutions for 5G, high-speed, and high-frequency applications, and more.



Copyright © 2019 I-Connect007. All rights reserved.