-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Ventec International Group Receives Consent for IPO on Taiwan Stock Exchange
December 21, 2018 | Ventec International GroupEstimated reading time: Less than a minute
Ventec International Group Co. Ltd has received formal consent from the Taiwan Stock Exchange (TWSE) on its Initial Public Offer (IPO) application. The completion date is set for April 2019.
Ventec filed its final IPO application with the TWSE in October 2018 and the approval comes after a successful presentation to the Listings Review Committee at the beginning of December. The Paid-in Capital and Total Equity at the time of application for the listing was NT$ 646,143 thousand / NT$ 1,648,711 thousand. Among the conditions set by the TWSE for the approval is that Ventec release a further 10% of public shares before the completion date.
"We are proud to have received the official consent from the TWSE today and look forward to an expeditious launching of the public offer and successful listing of our shares in Taiwan," said Jason Chung, CEO. "This outstanding achievement is based on the strength and dedication of our global team and I am truly thankful for everyone's hard work that ensures Ventec’s success."
Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates
Suggested Items
RTX's Ascentia to Receive Significant Upgrades
04/12/2024 | RTXCollins Aerospace, an RTX business, will introduce two major upgrades to the Ascentia software platform. Ascentia is a software solution for aircraft reliability management that is designed to streamline operations, enhance decision-making and predict future events.
IDTechEx Discusses the Role of Printed Sensors in Mass-Digitization
04/11/2024 | PRNewswireIntegrated sensors digitizing physical interactions are vital in everyday life. From personalized user experiences to warehouse inventory management, data-driven insights are driving demand for smarter sensors — and lots of them.
MKS Introduces ESI Geode G2 CO2 Laser System for High- Precision and High-Speed HDI and mSap Via Drilling
04/09/2024 | MKS Instruments, Inc.MKS Instruments, Inc., a global provider of technologies that transform our world, today announced the official launch of the ESI Geode™ G2 laser drill system, the next generation of the Geode™ platform for processing PCB and ICP materials.
DuPont Unveils Pyralux ML Laminate Series, Offering High Thermal Management for Extreme Environments
04/09/2024 | DuPontDuPont introduced the DuPont™ Pyralux® ML Series of double-sided metal-clad laminates, a unique addition to its extensive family of Pyralux® laminates for flexible and rigid-flex printed circuit boards (PCBs).
A Closer Look at Professional Development at IPC APEX EXPO 2024: 3D Printing and AI
04/09/2024 | I-Connect007 Editorial TeamWhile the finishing touches were being made to the show floor at IPC APEX EXPO, just as much activity was happening in the conference rooms of the Anaheim Convention Center on the days before the show officially opened. The hallways and classrooms were filled for standards committee development meetings and Professional Development Courses, and IPC hosted evening receptions for Emerging Engineers, ECWC, and those who are attending for the first time in a special “newcomers” event.