EIPC SpeedNews: News from the European PCB Industry


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News from EIPC

- Interview Technical Director Tarja Rapala-Virtanen by Pete Starkey, PCB007 

News from Imaps 

- Call for abstract submission for MicroTech 2019

News from the USA

-  Greensource Fabrication LLC Announces Acquisition AWP Group GmbH 

News from the UK

- Ventec Extends tec speed 20.0 Series of Low PIM Antenna-Grade Laminates

News from WECC Members

Click here for the International Events Diary 2018-2019

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Alun Morgan on the Future of PCB Materials

05/16/2019 | I-Connect007 Editorial Team
The I-Connect007 editorial team asked Alun Morgan, technology ambassador for Ventec International Group, to discuss materials at a high level. Our conversation delivered a detailed overview of the current state of the electronics industry.

Alun Morgan on Thermal Management and LEDs in Automotive

04/25/2019 | Judy Warner
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Ventec Focuses on High-mix Manufacturing

04/09/2019 | Barry Matties, I-Connect007
The I-Connect007 team recently toured Ventec International Group’s Suzhou factory where a modern, flexible manufacturing concept designed for fast delivery is enhancing their established volume manufacturing of specialty, high-reliability epoxy laminates and prepregs. Read on to know more about Ventec's ongoing investment in the facility to offer flexible world-class high-mix manufacturing capabilities for polyimide, thermal management, low-loss, and signal integrity material solutions.



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