-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
Economic Headwinds
In this issue, the biggest names in PCB manufacturing share their economic outlook for the upcoming year and beyond. As you will see, they were all bullish on our industry, but there was some apprehension as well. No one wants to get burned by another the supply chain disruption.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
The Shape of Things to Come: Curved, Flexible, Stretchable, and Three-Dimensional Electronics
December 27, 2018 | Corné Rentrop, HOLST CENTREEstimated reading time: 2 minutes
The seamless integration of electronics into flexible, curved, and even stretchable surfaces is being requested for several markets, such as automotive (dashboards, lighting, sensors), smart buildings (lighting facades, air quality, solar panels), medical (health patches, X-ray, analysis), and smart clothing (position tracking, sports). The requirement for products that are light, take up less space, conformable, and easily integrated into an existing design will result in an improved user interface. Additionally, the product should be robust from a cost-effective process consuming less material, and the technology should be consistent with the Internet of Things (IoT) roadmap.
The Printed Electronics Concept
Printed electronics deliver smart surfaces for applications by creating printed circuits on polymer films and utilizing traditional graphical printing techniques, such as screen printing and inkjet printing, to create the circuitry on foils in sheet or roll form.
An obvious advantage of printing electronics is the speed that can be achieved. For example, there is roll-to-roll screen printing equipment at the Holst Centre that runs at a maximum speed of 60 metres per minute, creating seamless circuits directly onto a roll (Figures 1 and 2). Photonic sintering of the metal ink allows high operating speeds to be maintained at a controlled temperature of approximately 130°C to prevent the foils from melting. In combination with roll-to-roll printing, pick-and-place assembly technology can place electrical components on the roll. Conductive adhesives are usually used as interconnects.
Crossovers and vias can be printed by alternating conducting and dielectric layers, which can maintain a PCB-like structure, only now on a roll. All polymer foil materials are suitable substrates for printed electronics. Polyes ters—such as polyethylene terephthalate (PET) and polyethylene naphthenate (PEN), rubberlike material (thermoplastic polyurethane or TPU), and even paper—are known substrates for printed electronics. The low costs of these materials immediately show the second advantage of printed electronics.
A third benefit of printed electronics is the ability to change the form factor of the PCB. Foils are easy to shape into the desired form by bending, rolling, cutting, and laminating. In this way, the electronics can be integrated easily into examples like clothing, building, and on-body applications.
The prints can also be seamless, effectively with no beginning and no end, so that the size of the PCB is limited only by the length and width of the roll. LED foils are printed at the Holst Centre with a length of 300 m and a width of 30 cm. The LED foils have a pitch of 5 cm and are used as a wallpaper lighting source for indoor applications.
To read the full version of this article which originally appeared in the October 2018 issue of Flex007 Magazine, click here.
Suggested Items
Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC
03/18/2024 | IPCDevan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC as its chief strategist for advanced packaging. In this newly created role, Dr. Iyer leads IPC's work with leading electronics companies and governments to identify and deliver news solutions to IPC members and the industry.
ROCKA Solutions Expands into Brazil
03/15/2024 | ROCKA SolutionsROCKA Solutions is thrilled to announce its expansion into Brazil. With a commitment to serving the growing needs of the Brazilian electronics manufacturing market, ROCKA has established new distribution and manufacturing services in the region.
Altium to Exhibit Latest Innovations at Embedded World 2024
03/15/2024 | AltiumAltium (ASX: ALU), a global leader in electronics design systems, will be at Embedded World 2024 to reveal its latest innovations across its ecosystem, spanning Altium Designer,
Northrop Grumman Honors Suppliers for Excellence
03/14/2024 | Northrop GrummanNorthrop Grumman Corporation honored more than 70 suppliers for their outstanding contributions in 2023. In an annual recognition event, the companies included women-, minority- and veteran-owned small businesses as well as those operating in underdeveloped areas.
Indium Corporation Celebrates 90 Years of Materials Science Innovation
03/13/2024 | Indium CorporationIndium Corporation will commemorate its 90th anniversary on March 13. Indium Corporation’s innovative products, especially its advanced soldering solutions, are found in many common consumer electronics and high-reliability technologies such as electric vehicles, mobile devices, life-saving medical devices, and emerging 5G technology to name just a few.