Top 10 Most-Read PCB007 Interviews of 2018

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Here’s a list of the top 10 most-read PCB interviews in the past year. Topping the list is an interview done by Publisher Barry Matties with industry veteran Gene Weiner, who talked about the market conditions in China, and any effect the new U.S. administration might have on trade relations going forward. Read on!

1. In Terms of Experience, a 10,000-foot View of China

In the past 30+ years of PCB manufacturing in China, you would be hard-pressed to find someone more connected to the pulse of the Asian market than Gene Weiner. Barry Matties met with the industry veteran at HKPCA to get his take on the show, the current and future market conditions of China, and any effect the new U.S. administration might have on trade relations going forward.

2. A Plug-in that Connects CAD Software to 3D Printer

Nano Dimension's DragonFly 2020 Pro 3D Printer is a highly accurate and versatile inkjet deposition and curing system for printing professional multilayer circuit boards, structural electronics and antennas. In a sweeping discussion with Nano Dimension USA President Simon Fried, all my questions were answered about this innovative technology.

3. Cicor’s Approach to Miniaturization: Cost of Function, and More

Barry Matties spoke with Karl Heinz-Fritz, VP of technology, about Cicor’s newest product line, which can shrink the size of a circuit by up to 40%, and the importance of measuring the cost of functionality.

4. Orbotech’s Strategic Decision for End-to-End Partnership Benefits Everyone

Barry Matties met with Sharon Cohen, president of Orbotech West, at productronica 2017 to discuss what’s new at Orbotech, specifically their shift to be more customer-centric and to provide regional coverage across the globe. He also discusses the current trends in the marketplace and Industry 4.0.

5. The Best It’s Ever Been, Every Year: The Goal for IPC, Part 1

The end of 2017 caps an exciting time for IPC and IPC China as membership has grown substantially, in part because of new offerings from the organization to its Asian members. Meeting with Barry Matties at HKPCA, John Mitchell and Phil Carmichael discuss the areas of focus for IPC in the upcoming year, first and foremost being education and welcoming a new generation into the industry.

6. Staying Ahead of Market Trends Through Education

ESI equipment has been in high demand with the recent rise of flex and HDI. But when Barry Matties met with Patrick Riechel and John Williams at HKPCA, they explained that it is really ESI’s future protection and flexibility in the process that keeps them ahead of the market and allows for ongoing success.

7. Welcome to the Silicon Valley Neighborhood: Nano Dimension Arrives in California

I-Connect007 Technical Editor Dan Feinberg accepted an invitation recently to tour Nano Dimension’s new USA headquarters in Santa Clara’s Silicon Valley, which included a sit-down with President and Co-Founder Simon Fried.

8. Blue Sky for Eagle Electronics

I recently had the opportunity to chat with the new director of sales and marketing at Eagle Electronics, Andy D’Agostino. I’ve visited Eagle before; they are endlessly busy, with good things going on, so I was happy when I learned that Brett McCoy was now COO and another fellow had taken over some of the sales and marketing activities. Andy comes with a wealth of experience and seems to have settled in nicely.

9. Bridging Knowledge and Understanding of Thermal Management Materials

At IPC APEX EXPO recently, Pete Starkey and Ian Mayoh, Ventec International’s technical support manager, had a chance to sit down and discuss the I-Connect007 micro E-book: The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, of which Ian is a co-author.

10. Riding the Tsunami of Success in Asia

Since Phil Carmichael has overseen IPC Asia, the program and its membership have grown substantially, and with good reason. Phil met with Barry Matties at HKPCA to discuss how IPC offerings such as the QML program and helping suppliers become CSR compliant has allowed IPC to become a vital resource for suppliers in Asia.

 

Here’s a list of the top 10 most viewed PCB interviews in the past year.

03/28/2023 | Patty Goldman, I-Connect007

Patty Goldman catches up with Gene Weiner, the longest-serving member of IPC, about his experience meeting with the next generation of engineers in IPC’s Emerging Engineers program through a unique contest held at IPC APEX EXPO 2023. Weiner, who has attended well over 60 annual IPC meetings, shared his unflagging optimism and the lessons he’s learned over his illustrious career with the young professionals who managed to find him at the show. With so much still to do, Weiner has no plans to retire any time soon; he’s already hard work helping IPC develop a new program to support aspiring managers in the industry.

03/23/2023 | Pete Starkey, I-Connect007

On the Wednesday of IPC APEX EXPO week, IPC President and CEO Dr. John W. Mitchell stylishly delivered his keynote address, “Fire Your Hiring Habits!” to a packed ballroom full of round tables all immaculately laid for a sit-down lunch. Announced by IPC Hall-of-Famer Joe O’Neil with a Rolling Stones track in the background, Mitchell’s presentation, subtitled “Finding and keeping the best talent is fundamental to building electronics better,” offered relevant and valuable guidance on understanding human nature and how this knowledge can help you find and keep the right individuals for your organisation.

03/22/2023 | John W. Mitchell, IPC

What goes down must also come up. This is not the idiom we’re used to hearing, but I’d like to apply it to IPC APEX EXPO 2023. After a few years of lower attendance numbers due to the COVID pandemic, 2023 ushered in a re-invigorated group of attendees, exhibitors, speakers, event contractors, and staff to the show floor and meeting rooms. IPC APEX EXPO 2023 was fueled by the possibilities of new advances in electronics manufacturing.