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There has been an increase in the demand for high temperature interconnect solutions at circuit board level joining with recent introductions of high-power semiconductors and increased operating temperatures.
Application areas for these new devices include electric vehicles, renewable energy, avionics, and oil and gas. Reliable operation in these environments require a combination of performance improvements in components, interconnects and substrates.
In line with this, NPL’s Electronics Interconnection Group will be holding a webinar on increasing the performance of organic PCBs at higher temperatures on January 17.
This Group is internationally recognized for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker migration and conformal coating research. The team investigates interconnect properties and develop metrological techniques to characterize performance, frequently in multiple domains. Research is focused on the emerging technologies within printed electronics, harsh and high temperature electronics, wearable technology and electrochemical performance in coating barrier systems.