NPL Webinar on Increasing the Performance of Organic PCBs


Reading time ( words)

There has been an increase in the demand for high temperature interconnect solutions at circuit board level joining with recent introductions of high-power semiconductors and increased operating temperatures.

Application areas for these new devices include electric vehicles, renewable energy, avionics, and oil and gas. Reliable operation in these environments require a combination of performance improvements in components, interconnects and substrates.

In line with this, NPL’s Electronics Interconnection Group will be holding a webinar on increasing the performance of organic PCBs at higher temperatures on January 17.

This Group is internationally recognized for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker migration and conformal coating research. The team investigates interconnect properties and develop metrological techniques to characterize performance, frequently in multiple domains. Research is focused on the emerging technologies within printed electronics, harsh and high temperature electronics, wearable technology and electrochemical performance in coating barrier systems.

Share

Print


Suggested Items

Dan Gamota Discusses Flex and Alternative Substrates

03/14/2019 | Patty Goldman and Andy Shaughnessy, I-Connect007
As the VP of manufacturing technology and innovation for Jabil, Dan gave us his take on the current state of flex and alternative substrates and explained why modeling, automation, and process controls are likely to be key ingredients in the recipe for manufacturing non-FR-4 boards in the future.

RTW IPC APEX EXPO 2019: Insulectro Sees Growth and Opportunities in Printed Electronics

03/11/2019 | Real Time with...IPC
Judy Warner speaks with Tim Redfern, Insulectro president, and Kevin M. Miller, VP of sales, about growth in the printed electronics market, the direction Insulectro is going, and opportunities for North American PCB suppliers. They note that the company will increase their focus and investment in the printed electronics market.

Flex/MSTC Joint Conference: A Collaborative Week in Monterey

03/06/2019 | Nolan Johnson, I-Connect007
Collaboration filled the air at the Hyatt Regency in Monterey, California, as the 18th annual Flex/Mems&Sensors technical conference brought flex technology and sensor experts and 550+ attendees together to network and share ideas from February 18–21, 2019.



Copyright © 2019 I-Connect007. All rights reserved.