Rogers to Participate in CJS Investor Conference


Reading time ( words)

Rogers Corporation will be presenting at the 19th Annual CJS Securities “New Ideas for the New Year” Investor Conference, on Wednesday, January 9, 2019 in New York City, New York. Bruce Hoechner, president and CEO, who will be joined by Mike Ludwig, SVP and CFO, will provide an overview of the company; discuss its competitive position and its strategies for growth.

Share

Print


Suggested Items

Ventec Focuses on High-mix Manufacturing

04/09/2019 | Barry Matties, I-Connect007
The I-Connect007 team recently toured Ventec International Group’s Suzhou factory where a modern, flexible manufacturing concept designed for fast delivery is enhancing their established volume manufacturing of specialty, high-reliability epoxy laminates and prepregs. Read on to know more about Ventec's ongoing investment in the facility to offer flexible world-class high-mix manufacturing capabilities for polyimide, thermal management, low-loss, and signal integrity material solutions.

Catching up with Fineline-Global N. American CEO Eran Navick

06/20/2018 | Dan Beaulieu
After entering the North American marketplace just six months ago, printed circuit board provider Fineline-Global is making its mark. As the largest value-added PCB supplier in the world, Fineline prides itself on being any able to meet any challenge for any company in any part of the world. I recently had the chance to sit down with Eran Navick, the company’s North American CEO to catch up on how things are going.

Setting the Record Straight: CEO Asher Levy on the Future of Orbotech

04/23/2018 | Barry Matties, I-Connect007
With the recent planned acquisition of Orbotech in place by maker KLA-Tencor, much of the industry has speculated about Orbotech’s future. Barry Matties spoke with CEO Asher Levy about what lies in store for the Orbotech group and, more specifically, their PCB division should the deal close.



Copyright © 2019 I-Connect007. All rights reserved.