PCB Manufacturing and PCB Depaneling Solutions from LPKF


Reading time ( words)

LPKF Laser & Electronics will be exhibiting at the IPC/APEX Expo in San Diego, California in booth 1651 this year, demonstrating its PCB depaneling and flex PCB drilling laser systems.

LPKF’s flex drilling systems are equipped for high through-put, high-yielding PCB drilling applications, allowing engineers to increase panel yield by an estimated 20% or even save on production steps. Common applications include drilling microvias, clean cutting of cover layer material, efficient and space-saving profiling, and blank cutting with cut edge quality. Engineers increase margins with the new generation of flexible laser machine for more efficient PCB processing. Additionally, laser technology achieves residue-free results that require no post-processing, saving the process step. Further, the number of modules per panel and the packing density can be increased, which reduces the manufacturing cost.

LPKF’s PCB depaneling systems are compact, developed for extremely clean and fast cutting PCB panels and cover layers. It reduces lead times and eliminates tooling costs of layout changes. The substrates are held securely on a vacuum table. This is ideal for depaneling, cutting and engraving a variety of substrates (cover layers, rigid, flex and rigid/flex).

In addition to these systems, LPKF will also be demonstrating its laser plastic welding systems and rapid PCB prototyping technology at the show. For more information on LPKF’s latest laser-based solutions, visit LPKF in booth 1651 at the IPC APEX EXPO 2019.

About LPKF 

Established in 1976, LPKF Laser & Electronics manufactures milling and laser systems used in circuit board and microelectronics fabrication, medical technology, and the automotive sector. LPKF’s worldwide headquarters is located in Hannover, Germany and its North American headquarters resides near Portland, Oregon.

Share

Print


Suggested Items

Nano Dimension Details New DragonFly LDM

08/21/2019 | Dan Feinberg, Technology Editor, I-Connect007
Dan Feinberg talks with Nano Dimension CEO Amit Dror about the new DragonFly LDM 3D printer technology announced by the Israeli company on July 24, 2019, aimed at increasing machine uptime and moving forward from prototyping to higher production volumes.

Dissecting the IPC Regional Survey on PCB Technology Trends

07/15/2019 | I-Connect007 Editorial Team
Sharon Starr, Denny Fritz, and Mike Carano talk about the global 2018 IPC Technology Trends Report released early this year—the size of the survey, how it was conducted, the general findings, and regional differences. They also shared their takeaways and regional insights, and the industry outlook over the next five to 10 years.

Emma Hudson: From Tomboy to Tech Lead

06/21/2019 | Gen3
In this interview, Emma Hudson, CTO of Gen3, and Gayle Paterson, founder of Female Leaders in Tech, Everywhere (FLITE), discuss careers and the electronics industry.



Copyright © 2019 I-Connect007. All rights reserved.