Rogers to Exhibit Latest Material Solutions at IPC APEX EXPO 2019


Reading time ( words)

Rogers Corporation will be exhibiting at the IPC APEX EXPO 2019, January 29 through January 31, at the San Diego Convention Center in San Diego, California. The IPC APEX EXPO is the leading event for the printed circuit board and electronics manufacturing and assembly industry, providing a full technical conference along with the exhibitor expo.

Rogers Corp. (booth #117) will be exhibiting a wide array of its high-performance circuit materials, including thin RO4000 materials for use in advanced millimeter wave multi-layer designs, high impedance laminates for antennas, and a newly introduced laminate for use in radar sensors. It will also contribute to the technical conference with a presentation on January 29 by John Coonrod, technical marketing manager.

New Laminate for Radar Sensors

Rogers will showcase its recently launched RO3003G2laminate for use in radar sensor designs. RO3003G2 laminates build on Rogers’ industry leading RO3003 platform to provide radar sensor designers with improved insertion loss and reduced dielectric constant (Dk) variation.

The combination of optimized resin and filler content along with the introduction of Very Low Profile ED copper translates to a Dk of 3.00 @ 10 GHz (clamped stripline method) & 3.07 @ 77 GHz (microstrip differential phase length method).

These laminates also show very low insertion loss of 1.3dB/inch for 5 mil laminates as measured by the microstrip differential phase length method.

RO4000 Products for Multi-Layer Structures:

RO4000 Thin Materials are next generation products designed to meet the existing and emerging needs of advanced millimeter wave multi-layer designs.

RO4835T laminates, offered in a 2.5 mil, 3 mil and 4 mil core thickness, are 3.3 Dk, low loss, spread glass reinforced, ceramic filled thermoset materials designed for inner-layer use in multilayer board designs, and complement RO4835 laminates when thinner cores are needed. RO4450T Bonding Materials are 3.2-3.3 Dk, low loss, spread glass reinforced, ceramic filled bonding materials that were designed to complement RO4835T and the existing RO4000 laminate family, and come in 3 mil, 4 mil or 5 mil thicknesses.

RO4835T laminates and RO4450T bonding materials exhibit excellent Dk control for repeatable electrical performance, a low z axis expansion for plated through hole reliability, and are compatible with standard epoxy/glass (FR-4) processes.

These materials are an excellent choice for multilayer designs requiring sequential laminations, as fully cured RO4000 products are capable of withstanding multiple lamination cycles. RO4835T laminate and RO4450T bondply have the UL 94 V-0 flame retardant rating, and are compatible with lead-free processes.

Lastly, CU4000 and CU4000 LoPro Foilsare sheeted foil options for designers looking for foil lamination builds, and provide good outer layer adhesion when used with RO4000 products.

Share

Print


Suggested Items

Advances in Substrates for Thermal Management

02/13/2020 | Pete Starkey, I-Connect007
Pete Starkey and Eduardo Benmayor, general manager for Aismalibar, discuss ways in which insulated metal substrates have been modified to relieve stresses on the solder joints of high-end LED assemblies during thermal cycling. Eduardo also describes a range of thermally conductive FR-4 laminates that can be processed like standard FR-4 for applications where thermal dissipation can be maximized without changing the design.

Not All Plating Lines Are Created Equal

02/12/2020 | I-Connect007 Editorial Team
Barry Matties and Happy Holden met with CEO Michael Ludy and CMO Sarah Großmann from Ludy, a company specializing in galvanic plating equipment for PCBs. This interview gives an overview of Ludy and their latest advancements in PCB plating equipment.

AT&S: Working With Designers on a Global Level

02/05/2020 | Barry Matties, I-Connect007
Barry Matties recently took a tour of AT&S’s Austrian factory, which is developing new circuit design strategies surrounding embedded and active components. Gerald Weis discusses the company’s focus on serving and educating PCB designers around the world, as well as their plans to embrace the latest technology and Industry 4.0 processes going forward.



Copyright © 2020 I-Connect007. All rights reserved.