Meyer Burger Uses Agfa DiPaMat Ink to Win IPC APEX EXPO Innovation Award


Reading time ( words)

Agfa’s DiPaMat SolderMask inkjet ink makes an essential contribution to Meyer Burger’s PiXDRO inkjet solution for the production of printed circuit boards (PCB) to win the 2019 IPC APEX Innovation Award.

PCB manufacturing is rapidly transforming from analogue lithographic film and chemistry based processes to digital inkjet technologies to reduce waste and increase production flexibility and efficiency.

One of the new processes inkjets Agfa’s DiPaMat SolderMask in multiple layers exactly where needed in the necessary thickness on the board’s circuitry, to achieve the required physical and electrical properties. This replaces the traditional subtractive method whereby the full PCB surface is covered with photo-imageable ink and then selectively developed away.

Meyer Burger’s PiXDRO solution includes the use of DiPaMat SolderMask, which allows the company to present a fully optimised and market-ready soldermask solution, and wins this year’s IPC APEX Innovation Award.

About DiPaMat SolderMask

DiPaMat is the brand name of Agfa’s inkjet inks for application in the PCB industry. The portfolio includes Legend inks, Etch Resist ink as well as the recently launched SolderMask ink, and puts Agfa at the forefront of the industry’s shift to inkjet solutions for PCB manufacturing. DiPaMat SolderMask is a solvent-free UV inkjet ink. It has best balanced properties of viscosity and curing to allow for flexible customisation and quick integration with most major print engines.

About Agfa

The Agfa-Gevaert Group develops, manufactures and distributes an extensive range of analogue and digital imaging systems and IT solutions, mainly for the printing industry and the healthcare sector, as well as for specific industrial applications. Agfa’s headquarters and parent company are located in Mortsel, Belgium. The Agfa-Gevaert Group achieved a turnover of 2,443 million euro in 2017. DiPaMat, Agfa and the Agfa rhombus are trademarks of Agfa-Gevaert N.V., Belgium, or its affiliates.

Share

Print


Suggested Items

Better to Light a Candle: Chapter One—Prepping the Next Generation

01/08/2019 | Marc Carter, Independent Contributor
There has been a considerable amount of (electronic) ink and words shared in our industry bemoaning the graying-out of our industry and the growing shortage of skilled people at all levels. (See the May 2017 PCB007 Magazine column “Help Wanted—and How!” for just one example). As is usually the case, though, when all is said and done, more has been said than done.

MacDermid Enthone Discusses Consolidation Benefits

01/08/2019 | Pete Starkey, I-Connect007
At the 2018 electronica exhibition in Munich, Frando van der Pas, director of marketing and sales for MacDermid Enthone—Europe, and Technical Editor Pete Starkey discussed the consolidation benefits and the vision and future of the company.

150+ Years of Experience: Reflections with Three Industry Icons

11/20/2018 | Barry Matties, I-Connect007
You would be hard-pressed to find a more knowledgeable and experienced group than that of Gary Ferrari, Gene Weiner, and Happy Holden. In a brief interview with Barry Matties, these three industry icons consider the past, present, and future state of electronics manufacturing while also offering advice to the newest generation of manufacturers.



Copyright © 2019 I-Connect007. All rights reserved.