RTW IPC APEX EXPO 2019: Ventec Highlights Core Solutions for Thermal Management

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Jack Pattie, president of Ventec International Group, speaks with I-Connect007 Guest Editor Kelly Dack about the many heat issues associated with circuit boards right now—whether in general applications, power applications, PCs—as everyone demands smaller, faster, and more powerful systems.

Pattie talks about how they are helping their customers address their thermal management issues, and his outlook for the year.

To watch this interview, click here.

01/31/2019 | Real Time with...IPC

Jack Pattie, president of Ventec International Group, speaks with I-Connect007 Guest Editor Kelly Dack about the many heat issues associated with circuit boards right now—whether in general applications, power applications, PCs—as everyone demands smaller, faster, and more powerful systems.

01/21/2019 | Edy Yu, I-Connect007

Edy Yu, managing editor for PCB007 China, caught up with Daniel Schmidt, Atotech’s director of global marketing, during the 2018 HKPCA and IPC Show in December. Edy and Daniel discussed Atotech’s new announcements at the show including their new solutions for 5G, high-speed, and high-frequency applications, and more.

11/06/2018 | Pete Starkey, I-Connect007

The UK chapter of the global IMAPS community of electronics and microelectronic packaging engineers shared a wealth of knowledge and wisdom about PCB substrate technology trends, developments, and future requirements in a webinar on the first of November.