RTW IPC APEX EXPO 2019: Ventec Highlights Core Solutions for Thermal Management


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Jack Pattie, president of Ventec International Group, speaks with I-Connect007 Guest Editor Kelly Dack about the many heat issues associated with circuit boards right now—whether in general applications, power applications, PCs—as everyone demands smaller, faster, and more powerful systems.

Pattie talks about how they are helping their customers address their thermal management issues, and his outlook for the year.

To watch this interview, click here.

Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates

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