Ventec at APEC 2019: Thermal Management and IMS Solutions for Power Electronics


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Ventec International Group will showcase its latest power electronics PCB material technology innovations at APEC 2019, which is taking place at the Anaheim Convention Center from March 18-20 in Anaheim, California, USA. The Ventec technology team will be on hand on booth #438 showcasing unique laminate & prepreg capability solutions designed for the most demanding thermal applications.

Ventec is set to further strengthen its position as a global leader in technology for high-performance thermal management and signal integrity materials at the Applied Power Electronics Conference in Anaheim, USA on booth #438.

Show highlights include:

VT-4B Series IMS – thermal conductivity from 1.0 to 10.0 W/m.K

For superior thermal dissipation of an insulated metal substrate (IMS), VT-4B series materials offer the perfect performance and properties. VT-4B1 is designed for bending and forming with thermal conductivity of 1.0 W/m.K, for minimum Zth 0.078°C*in2/W. From VT-4B3 to VT-4B9, the family provides a broad choice of thermal performance: 3 W/m.K to 10.0 W/m.K, and minimum Zth from 0.026°C*in2/W to 0.0078°C*in2/W satisfy demanding applications including high power-density converters and power supplies. For direct-to-metal connection of electrically isolated heat sources, VT-4B5SP selective preference substrates ensure maximum thermal efficiency and place dielectric insulation only where needed.

VT-5A2—Highest performance thermally conductive laminate material

The perfect choice for hybrid multilayer low-loss constructions, VT-5A2 offers a polymer matrix that is fully compatible with Ventec laminates, epoxy or polyimide-based materials including tec-speed. The lead-free assembly compatible material sets itself apart by offering highest performance thermal conductivity 8 times that of FR-4 at 2.2 W/m.K, a high Tg of 190°C, best in class thermal performance (T260 >60 minutes, T288 >30 minutes and T300 >15 minutes) and MOT of 130°C.

tec-speed 20.0—No more compromises—performance, price & availability

Power amplifiers are one of the world's most demanding printed circuit board applications where high frequency performance, loss characteristics and reliability are key. tec-speed 20.0 (VT-870) offers all three and more: unrivalled performance with Dk 3.00-3.48 and Df 0.002-0.0037, superior loss characteristics and highest reliability, combined with fast availability and efficient delivery through Ventec’s fully controlled and managed global supply chain and technical support-network.

Thermal Interface Materials

As a perfect complement to Ventec’s IMS material families, thermally conductive and standard laminates and prepregs for multilayer PCB’s, EMI Thermal’s thermal interface materials (TIM) will be presented on the booth. The range of materials distributed through Ventec includes double-sided thermal tape, electrical insulators, natural graphite and void fillers, that ensure reliability and performance and prevent electronic components from overheating and being damaged or burnt out.

About Ventec International Group

Ventec International is a premier supplier to the global PCB industry. With volume manufacturing facilities in Taiwan and China and distribution locations and manufacturing sites in both the US and Europe, Ventec specializes in advanced copper clad glass reinforced and metal backed substrates. Ventec materials, which include high-quality enhanced FR-4, high-speed/low-loss- and high-performance IMS material technology and an advanced range of thermal management solutions, are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015, and are backed by a fully controlled and managed global supply chain, sales- and technical support-network.

Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates

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