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MacDermid Alpha Electronics Solutions will be exhibiting at the CPCA Show 2019 being held during March 19–21 at the National Exhibition and Convention Center in Shanghai, China. This will be the first time that MacDermid Alpha Electronics Solutions will exhibit at the event as one company in the region.
MacDermid Alpha’s innovations in the printed circuit arena will focus on enabling technology trends such as MSAP process for miniaturization in smartphones as well as solutions for high frequency applications in 5G.
The MacDermid Enthone brand of circuitry solutions products will be highlighting the fully expanded MacuSpec acid copper metallization portfolio, and Systek metallization for IC substrate in applications such as HDI, high aspect ratio copper plating, and package component wet processing. The Alpha brand of assembly products will be highlighting low temperature solder alloys, including the electric vehicle focused silver sintering technology.
MacDermid Alpha’s Circuitry and Assembly Solutions’ experts will be available to discuss the latest cost effective chemical and material solutions providing process predictability and smooth scale-up at every step in electronics manufacturing.
For additional information about MacDermid Alpha’s latest technologies and products, please visit booth #8C36 at CPCA Show 2019.
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.