RTW IPC APEX EXPO 2019: Limata Unveils Exciting Developments in LDI


Reading time ( words)

Lino Sousa, sales, Limata, explains to Pete Starkey the latest developments in Limata’s laser direct imaging technology, which eliminates the need to change the solder mask. With this technology, Sousa says black solder mask and green solder masks look the same to the UV. Sousa says there is a system in qualification for two years now, and that they will start installation in March in North America.

To watch the interview, click here.

Share

Print


Suggested Items

Dissecting the IPC Regional Survey on PCB Technology Trends

07/15/2019 | I-Connect007 Editorial Team
Sharon Starr, Denny Fritz, and Mike Carano talk about the global 2018 IPC Technology Trends Report released early this year—the size of the survey, how it was conducted, the general findings, and regional differences. They also shared their takeaways and regional insights, and the industry outlook over the next five to 10 years.

Emma Hudson: From Tomboy to Tech Lead

06/21/2019 | Gen3
Interview between Emma Hudson and Gayle Paterson, founder of FLITE (Female Leaders in Tech, Everywhere).

Electrolytic Plating: Filling Vias and Through-holes

05/28/2019 | M. Özkök, S. Lamprecht, A. Özkök, D. Akingbohungbe, and M. Dreiza, Atotech Deutschland Gmbh; and A. Stepinski, Greensource Fabrication
The continuously evolving electronics industry environment is causing the development of various electrolytic copper processes for different applications over the past several decades. This article describes the reasons for development and a roadmap of dimensions for copper-filled through-holes, microvias, and other copper-plated structures on PCBs.



Copyright © 2019 I-Connect007. All rights reserved.