FCCL Makers Keen to Develop New Material Solutions for 5G

Reading time ( words)

Taiwan makers of flexible copper clad laminate (FCCL) and coverlay, materials for flexible PCBs, are gearing up to develop new material solutions and build new production lines to cash in on huge demand for FPCBs for 5G smartphones, according to a Digitimes report.

Among them, Taiflex Scientific has completed preparations for volume production of newly developed heterogeneous modified polyimide (PI) materials, although downstream clients have yet to show clear willingness to incorporate the new materials. Taiflex is building new production lines at its plant in Nantong, China's Jiangsu Province, with construction to be completed in the third quarter of 2019 for trial runs in the fourth quarter. This is expected to enable the company to embrace the first wave of explosive demand for new 5G materials in 2020.

Another major maker, Asia Electronic Materials (AEM) is also constructing a new fab in Dongtai, also in Jiangsu Province, which will accommodate a maximum of 10 production lines. The company is set to start the first-stage trail runs of the new facilities in August 2019.



Suggested Items

Institute of Circuit Technology Evening Seminar

03/05/2019 | Martin Goosey
The Institute of Circuit Technology hosted its first 2019 seminar at the Woodland Grange Hotel in Royal Leamington Spa in the Midlands of England on February 26. The diverse programme of four presentations was introduced by ICT Chairman Andy Cobley, a professor at Coventry University, who stood in for Bill Wilkie, who had been taken ill at short notice.

Laser Focus on Flex and Rigid-flex

01/28/2019 | Barry Matties, I-Connect007
ESI’s Chris Ryder, director of Product Management, and Shane Noel, Flex Systems product manager, discuss laser vias for flex users and the increasing necessity for companies to collaborate early on and become more and more involved, whether that be in the product design, or with the process or base material manufacturers.

Atotech at HKPCA on Announcements and Advancements

01/21/2019 | Edy Yu, I-Connect007
Edy Yu, managing editor for PCB007 China, caught up with Daniel Schmidt, Atotech’s director of global marketing, during the 2018 HKPCA and IPC Show in December. Edy and Daniel discussed Atotech’s new announcements at the show including their new solutions for 5G, high-speed, and high-frequency applications, and more.

Copyright © 2019 I-Connect007. All rights reserved.