FCCL Makers Keen to Develop New Material Solutions for 5G

Reading time ( words)

Taiwan makers of flexible copper clad laminate (FCCL) and coverlay, materials for flexible PCBs, are gearing up to develop new material solutions and build new production lines to cash in on huge demand for FPCBs for 5G smartphones, according to a Digitimes report.

Among them, Taiflex Scientific has completed preparations for volume production of newly developed heterogeneous modified polyimide (PI) materials, although downstream clients have yet to show clear willingness to incorporate the new materials. Taiflex is building new production lines at its plant in Nantong, China's Jiangsu Province, with construction to be completed in the third quarter of 2019 for trial runs in the fourth quarter. This is expected to enable the company to embrace the first wave of explosive demand for new 5G materials in 2020.

Another major maker, Asia Electronic Materials (AEM) is also constructing a new fab in Dongtai, also in Jiangsu Province, which will accommodate a maximum of 10 production lines. The company is set to start the first-stage trail runs of the new facilities in August 2019.


Suggested Items

Michael Carano: A Focus on Process Control, Part 2

09/28/2022 | I-Connect007 Editorial Team
In this second half of our conversation, Michael Carano discusses some of the metrics that fabricators need to consider before investing in new processes, especially process control technologies, and some of the challenges board shops face updating brownfield sites.

Catching Up With John Johnson, New Director of Business Development at ASC

09/28/2022 | Dan Beaulieu, D.B. Management Group
It’s always good to catch up with old friends, especially when you can start working together. I recently spoke with my friend John Johnson, who has joined American Standard Circuits as the director of business development. At ASC, John will be using the Averatek A-SAP process that he was previously involved with. He shares some of his background and provides insight on the best ways to use this semi-additive PCB fabrication process that opens the capability window for forming trace and space.

A Focus on Process Control, Part 1

09/27/2022 | I-Connect007 Editorial Team
Michael Carano is a noted subject matter expert with respect to process control, electroplating and metallization technology, surface finishing, and reliability. So, it was only natural that we sat down to talk about mechanizing an existing facility given today’s fickle environment. Will any of the CHIPS funding trickle down to bare board fabrication? What process can be adjusted on the factory floor? The focus needs to be more than just on manufacturing and getting work out the door, he says, but also process control.

Copyright © 2022 I-Connect007. All rights reserved.