IPC Offers Course on Utilizing J-STD-001 and IPC-A-610 Together


Reading time ( words)

IPC’s popular standards, J-STD-001, recognized globally for its criteria on soldering processes and materials, and IPC-A-610, the most widely used electronics assembly acceptance document, complement each other when used together. IPC offers a new technical education course, Process and Acceptability Requirements: Utilizing J-STD-001 and IPC-A-610 Together, to provide instruction on how best to use these documents jointly.

This course is ideally suited for process engineers, quality managers, auditors and others defining contractual requirements for soldering and acceptance.

Attendees will learn:

  • How these documents complement each other and where they differ;
  • How to provide clear instructions on drawings and documentation;
  • What takes precedence when a conflict occurs in the requirements;
  • How to navigate the complex world of ensuring staff training and proficiency requirements can be met.
  • What is needed to properly flow down requirements to suppliers and the pitfalls of taking shortcuts.

“J-STD-001 and IPC-A-610 are written and revised in synergy,” said Teresa Rowe, senior director, assembly and standards technology, “so it makes sense to use them together. This course is designed to teach attendees how to use these standards jointly.”

Courses will be offered in the following locations:

  • April 2, 2019, King of Prussia, Pennsylania (full-day course)
  • May 5-6, 2019, Nuremberg, Germany (full-day course delivered over two half days)
  • September 10, 2019, Huntsville, Alabama (full-day course)
  • December 3, 2019, Anaheim, California (full-day course)

Share

Print


Suggested Items

IPC’s Hand Soldering Competition Program: A Brief History

08/06/2019 | Philippe Leonard, Director, IPC Europe
The history of the IPC Hand Soldering Competition (HSC) grew from the 2010 Scandinavian Electronics Event which saw the first Swedish Championship in hand soldering organized by Lars Wallin IPC Europe, Lars-Gunnar Klag and Krister Park.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 2)

07/24/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.

Optimizing Solder Paste Volume for Low-Temperature Reflow of BGA Packages

07/22/2019 | Keith Sweatman, Nihon Superior Co. Ltd
In this article, Keith Sweatman explains how the volume of low-melting-point alloy paste—which delivers the optimum proportion of retained ball alloy for a particular reflow temperature—can be determined by reference to the phase diagrams of the ball and paste alloys.



Copyright © 2019 I-Connect007. All rights reserved.