IPC’s Annual High-Reliability Forum Adds Microvia Summit


Reading time ( words)

IPC’s High Reliability Forum and Microvia Summit, a three-day technical conference to be held in Hanover, Md., May 14-16, will focus on electronics for mil-aero, automotive, and long-life applications.

The conference will commence with a half-day professional development session offered by Bhanu Sood, Ph.D., NASA Goddard Space Flight Center, titled, “Focus on PCB Quality to Drive Reliability.” Dr. Sood will review concepts of reliability and risk along with the relationship between quality and failure mechanisms. The application of non-destructive/destructive analysis techniques as well as materials characterization will be illustrated with the support of pertinent case studies.

Technical presentations will cover topics ranging from PCB design and laminate reliability, surface cleanliness and reliability, to microvia considerations and standard development updates. Panel discussions will open the conversation to attendees with subject matter experts addressing board and surface reliability challenges as well as microvia reliability testing.

The Microvia Summit is featured in 2019 since microvia challenges and reliability issues are of great concern to the printed board manufacturing industry and upstream users of printed boards. A new subcommittee, IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Committee, was formed in 2018 to investigate root causes of microvia interface failure. Speakers from that subcommittee will provide updates on their ongoing efforts.

“The High Reliability Forum and Microvia Summit provides an opportunity for those working with Class 3 electronics to interact with subject matter experts, facilitating true problem solving and cooperation to share best practices across applications focused on exceptional reliability requirements,” said Brook Sandy-Smith, IPC technical education program manager.

The IPC High Reliability Forum and Microvia Summit features sponsorships by Aqueous Technologies Corporation, PCB Technologies Ltd, and NTS. Exhibitors at the conference include BTG Labs, Colonial Circuits, Inc., ELANTAS PDG, Inc., NTS, PCB Technologies, Ltd, Summit Interconnect – Orange, and Zentech Manufacturing.

About IPC

IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 5,000 member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

Share




Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/13/2022 | Nolan Johnson, I-Connect007
The big news in the industry this week was the new bill introduced to the U.S. Congress in support of the PCB manufacturing industry. The Supporting American Printed Circuit Boards Act of 2022, which was introduced by Reps. Anna Eshoo (D-CA) and Blake Moore (R-UT), incentivizes “purchases of domestically produced PCBs as well as industry investments in factories, equipment, workforce training, and research and development.” The bill is a PCB-oriented complement to the semiconductor-oriented CHIPS Act of 2021.

Improved Thermal Interface Materials For Cooling High-Power Electronics

03/31/2022 | Jeff Brandman, Aismalibar North America
Heat has been a significant concern in electronics since the beginning of the electronics age when hot glowing vacuum tubes were first used to receive and transmit data bits. The transistor and integrated circuit effectively solved that basic problem, but increases in integration resulted in increased concentration of heat, exacerbated by relentless increases in operating frequency. While improvements in electronics technology have been able to mitigate many thermal issues at chip level thanks to improved semiconductor designs devised to operate at lower voltages (thus requiring less energy) the thermal management challenge continues to vex electronic product developers.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

03/25/2022 | Andy Shaughnessy, Design007 Magazine
It’s been a crazy week, with lots of bad news coming out of Ukraine. (I’m a news junkie by trade, but I confess that some days I just unplug from the news completely to avoid overdosing on negativity.) And, as you might have guessed, this is all having ill effects on our electronics supply chain, which is already stretched thin. This is reflected in our IPC news item that shows an uptick in PCB sales in February, but a drop in bookings YOY, in part due to the trouble in Eastern Europe. But there’s positive news in this week’s top reads. We have a NextFlex article about an innovative flexible technology called flexible hybrid electronics (FHE) and a great interview by Dan Beaulieu. We also have a column by Travis Kelly, who discusses PCBAA’s efforts to lobby for American manufacturing in Washington. And last but not least, let’s welcome our two newest columnists, Paige Fiet and Hannah Nelson, who discuss their excitement about entering this industry.



Copyright © 2022 I-Connect007. All rights reserved.