CCL Maker TUC Reports Robust Earnings Growth for 2018


Reading time ( words)

Copper clad laminate (CCL) maker Taiwan Union Technology (TUC) has reported robust earnings growth for 2018 on increased shipments of CCL products to the networking device and server sectors, according to Digitimes.

Net profits for 2018 totaled NT$1.836 billion ($59.59 million), increasing by 83.37% from a year earlier. The earnings translated into an EPS of NT$7.46 for 2018 compared to NT$4.12 a year earlier. The company also saw its revenues grow by 10.5% on year to NT$17.79 billion in 2018.

Digitimes reports that TUC has been enhancing its deployments in the high-margin CCL products targeting server, storage, networking and switch applications, seeing its products enter the supply chains of Nokia, Ericsson, Google, Amazon and Facebook.

Share

Print


Suggested Items

A Guide to High-reliability PCBs from Design to Specification

07/24/2019 | Jeff Beauchamp, NCAB Group
Creating reliable PCBs is an outcome of considering all aspects that can affect reliability as early as possible in the design process. The further down the design process, the more expensive and risky it can be to fix. As they say, everything starts with the design. Because a good board design improves the reliability of the end product and lessens the risk of failure.

Microvias: Links of Faith are Not Created Equally

07/18/2019 | Jerry Magera and J.R. Strickland, Motorola Solutions Inc.
Microvias connect adjacent copper layers to complete electrical paths. There are copper-filled microvias, which can be stacked to form connections beyond adjacent copper layers, and staggered microvias, which stitch adjacent copper layers with paths that meander on the layers between the microvias. This article discusses the various laser-drilled microvias and presents SEM photographs to begin the search for the root cause of weak copper interface.

An Examination of Glass-fiber and Epoxy Interface Degradation in Printed Circuit Boards

07/12/2019 | Bhanu Sood, Michael Osterman, and Michael Pecht, Center for Advanced Life Cycle Engineering
Multilayer organic laminates, which make up over 90% of the interconnecting substrates in electronics (standard FR-4 represents 85% of the substrates used for laminates), can develop a loss of electrical insulation resistance between two biased conductors due to conductive filament formation.



Copyright © 2019 I-Connect007. All rights reserved.