EIPC SpeedNews: News from the European PCB Industry

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News from EIPC

- Program Available! EIPC Summer Conference Leoben 2019

- Review Day 2 EIPC Winter Conference Milan 2019

News from Germany

- Ventec Upgrades ISO 7 Aerospace-standard Prepreg and Laminate Clean-room Facility in Germany

- Smart Systems Integration 2019 Once Again Offers Numerous Highlights

News from Norway

- All in Space is Not Rocket Science – Golden Cooperation Between Newcomer SatRevolution and Expert Elmatica

News from the UK 

- WNIE Live 2019 – Call for Papers!

News from the USA 

- Aegis Software Removes Critical Impediments to Industry 4.0 at SMTconnect 2019

News from WECC Members

Click here for the International Events Diary 2019



Suggested Items

Microvias: Links of Faith are Not Created Equally

07/18/2019 | Jerry Magera and J.R. Strickland, Motorola Solutions Inc.
Microvias connect adjacent copper layers to complete electrical paths. There are copper-filled microvias, which can be stacked to form connections beyond adjacent copper layers, and staggered microvias, which stitch adjacent copper layers with paths that meander on the layers between the microvias. This article discusses the various laser-drilled microvias and presents SEM photographs to begin the search for the root cause of weak copper interface.

An Examination of Glass-fiber and Epoxy Interface Degradation in Printed Circuit Boards

07/12/2019 | Bhanu Sood, Michael Osterman, and Michael Pecht, Center for Advanced Life Cycle Engineering
Multilayer organic laminates, which make up over 90% of the interconnecting substrates in electronics (standard FR-4 represents 85% of the substrates used for laminates), can develop a loss of electrical insulation resistance between two biased conductors due to conductive filament formation.

Emma Hudson: From Tomboy to Tech Lead

06/21/2019 | Gen3
Interview between Emma Hudson and Gayle Paterson, founder of FLITE (Female Leaders in Tech, Everywhere).

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