Call for Participation: IPC Electronics Materials Forum 2019


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IPC invites you to present at the upcoming IPC Electronics Materials Forum to be held on November 5–7, 2019.

This new technical conference will focus on developments in materials and processes associated with advanced electronics assembly and manufacturing. Materials enable advancement because it is possible to envision many future technologies, but they will never be fully realized without the materials and processes to manufacture them.

The content will focus on materials for board fabrication, assembly, and post-assembly protection. The over-arching theme of emerging technologies that challenge our existing materials set will inform attendees on developments needed for the future. Interactive panels will also extend an open forum to discuss solutions to these challenges.

Seeking presentations on emerging technologies challenging existing material sets.

Other topics of interest include:

Substrate Materials:

  • Novel board laminates
  • Surface finishes
  • Solder mask advancements
  • Flexible/wearable circuits
  • HDI developments

Assembly Materials:

  • New solder alloys
  • Flux development
  • Cleaning chemistries
  • Assembly process strategies
  • Thermal interface solutions

Protective Materials:

  • Cleaning chemistries
  • Conformal coatings
  • Adhesives
  • Underfills

Who Should Attend?

Engineers and managers that procure materials or qualify materials, or want to understand advancements in materials for the board, assembly, components, and protective layers: process engineers, manufacturing managers, materials scientists, SMT line managers, quality managers (for materials or failure analysis).

Please send title and short description to Brook Sandy-Smith, IPC technical education program manager, at BrookSandy@ipc.org by June 28, 2019.

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