ACB Invests in New Lamination Lines Technology


Reading time ( words)

Automatic Lamination Technologies (ALT) under brand name Dynachem are pleased to announce that ACB NV (Belgium) has installed successfully two state-of-the-art dry film lamination lines for inner- and outer layers.

“We at ACB are pleased to have chosen Dynachem after extensive evaluation. Both lines have been installed successfully and running well,” commented Jan Van De Putte (responsible engineer) /Wim Van De Moortel (process engineering manager at ACB).

“We are extremely pleased to have been chosen by ACB once again for both innerlayer and outer layer dry film lamination lines. We believe that our SmartLam Model 5200 can satisfy the technology required in the current PCB industry. This laminator  model has the flexibility to manage either panel types down to 1-mil core (rigid and flex), using Dynachem unique clamping thin layer support and the automatic dry film tension device, and up to 12.7mm thickness without any special adjustment. Machine can be equipped also with its own wet module when higher dry film adhesion is required. In addition the new HMI software meets the industry 4.0 requirement and it can support also the SECS/GEM protocol mostly used in the semiconductors industry,” said ALT – Dynachem Managing Director Osvaldo Novello.

About ACB

ACB is one of Europe’s leading manufacturer of high technology and quick turnaround printed circuit boards. they offer a wide range of technologies including rigid, flex-rigid and flexible multilayer boards. to learn more about ACB, please visit webpage on www.acb.be

About Automatic Lamination Technologies—Dynachem

ALT – Dyanchem is an independent, privately-held company fully dedicated to design, manufacture and offer high Technology equipment to the PCB, chemical milling, semiconductor and photovoltaic industries.

To learn more about ALT- Dyanchem, please visit webpage on www.dynachem.eu.

Share




Suggested Items

Understanding the UHDI Market

11/28/2022 | I-Connect007 Editorial Team
The more we investigate UHDI in the current market, the more advanced packaging becomes a part of the conversation. Yet there are so many questions to be answered. The I-Connect007 Editorial Team met with Calumet’s Todd Brassard and Meredith LaBeau recently to get answers to these questions and find out where the UHDI market is headed.

Taiyo’s Brian Wojtkiewicz Discusses Flex, HDI and More

10/25/2022 | Nolan Johnson, I-Connect007
Nolan Johnson spoke with Brian Wojtkiewicz at PCB West about Taiyo’s latest developments in solder mask technology. They discussed the company’s advances in flexible circuits, HDI, and much more. In particular, Brian discusses the importance of reliability in fabrication and assembly. "We’re always in the fabricators’ shops. I’m out in the field talking to them, helping the operators understand the process, and making things work better because then we don’t have issues down the road," he says.

Catching Up With John Johnson, New Director of Business Development at ASC

09/28/2022 | Dan Beaulieu, D.B. Management Group
It’s always good to catch up with old friends, especially when you can start working together. I recently spoke with my friend John Johnson, who has joined American Standard Circuits as the director of business development. At ASC, John will be using the Averatek A-SAP process that he was previously involved with. He shares some of his background and provides insight on the best ways to use this semi-additive PCB fabrication process that opens the capability window for forming trace and space.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.