ACB Invests in New Lamination Lines Technology


Reading time ( words)

Automatic Lamination Technologies (ALT) under brand name Dynachem are pleased to announce that ACB NV (Belgium) has installed successfully two state-of-the-art dry film lamination lines for inner- and outer layers.

“We at ACB are pleased to have chosen Dynachem after extensive evaluation. Both lines have been installed successfully and running well,” commented Jan Van De Putte (responsible engineer) /Wim Van De Moortel (process engineering manager at ACB).

“We are extremely pleased to have been chosen by ACB once again for both innerlayer and outer layer dry film lamination lines. We believe that our SmartLam Model 5200 can satisfy the technology required in the current PCB industry. This laminator  model has the flexibility to manage either panel types down to 1-mil core (rigid and flex), using Dynachem unique clamping thin layer support and the automatic dry film tension device, and up to 12.7mm thickness without any special adjustment. Machine can be equipped also with its own wet module when higher dry film adhesion is required. In addition the new HMI software meets the industry 4.0 requirement and it can support also the SECS/GEM protocol mostly used in the semiconductors industry,” said ALT – Dynachem Managing Director Osvaldo Novello.

About ACB

ACB is one of Europe’s leading manufacturer of high technology and quick turnaround printed circuit boards. they offer a wide range of technologies including rigid, flex-rigid and flexible multilayer boards. to learn more about ACB, please visit webpage on www.acb.be

About Automatic Lamination Technologies—Dynachem

ALT – Dyanchem is an independent, privately-held company fully dedicated to design, manufacture and offer high Technology equipment to the PCB, chemical milling, semiconductor and photovoltaic industries.

To learn more about ALT- Dyanchem, please visit webpage on www.dynachem.eu.

Share

Print


Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

04/30/2021 | Nolan Johnson, I-Connect007
This week’s biggest news came in the form of industry briefings—there were a lot of them and the news was universally positive. The news you need to read for this week includes three reports from IPC detailing: the strength and risks in the global economic recovery; a strong EMS book-to-bill ratio; and strong North American PCB sales. Zeroing in on a single company, Apple reported a significant jump in revenue.

Isola Releases IS550H Material

04/26/2021 | Nolan Johnson, I-Connect007
Nolan Johnson speaks with Michael Gay of Isola and Chris Hunrath of Insulectro about the release of their new halogen-free, high-thermal reliability material, which they hope fills the gap in the market between epoxies and polyimides.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

04/23/2021 | Andy Shaughnessy, I-Connect007
This week, we bring you a wide swath of news, columns, and articles from the past week. Altium announced a new cloud platform that connects design stakeholders with users of its Altium 365 environment. Cadence Design Systems has acquired a company that develops computational fluid dynamics technology to help expand its system analysis offerings.



Copyright © 2021 I-Connect007. All rights reserved.