Reading time ( words)
Taiwan-based FPCB materials suppliers Asia Electronic Materials (AEM) and Taiflex Scientific, after experiencing lackluster revenue performances in the first quarter of 2019, expect more orders from Chinese smartphone clients to drive their revenue growth in the remaining quarters of the year, according to Digitimes.
Both firms are dedicated to producing FCCL (flexible copper clad laminate) and CL (coverlay). AEM saw its revenues for the first quarter decline 2.69% on year to NT$370 million (US$11.98 million), while Taiflex witnessed its corresponding figure plunge 31.35% on year to NT$1.373 billion, mainly driven by weak sales of new iPhone devices in the first quarter.
AEM pointed out that China handset vendors still expect double-digit growths in their shipments for 2019 and they are also actively proceeding with deployments of 5G smartphones, which will help boost demand for CL and FCCL products and drive the firm's revenue increases in 2019 and beyond, Digitimes reports. Taiflex, meanwhile, expects the first wave of demand for new FCCL materials from China to appear in the second half of 2019, when Chinese handset vendors are expected to release more 5G smartphone models.
Chudy Roosevelt Nwachukwu, ITEQ Corporation
Accurate characterization of frequency-dependent inhomogeneous dielectric material properties is key to the optimal design of high performance and cost-effective PCB antennas. These antennas will be required to enable the plethora of devices forecasted for 5G/6G communication. Therefore IT-88GMW, an advanced resin system reinforced with tightly woven thin glass fibers has been formulated to improve the Q-factor of interconnects and passive components fabricated on PCB laminates.
Jeff Brandman, Aismalibar North America
Heat has been a significant concern in electronics since the beginning of the electronics age when hot glowing vacuum tubes were first used to receive and transmit data bits. The transistor and integrated circuit effectively solved that basic problem, but increases in integration resulted in increased concentration of heat, exacerbated by relentless increases in operating frequency. While improvements in electronics technology have been able to mitigate many thermal issues at chip level thanks to improved semiconductor designs devised to operate at lower voltages (thus requiring less energy) the thermal management challenge continues to vex electronic product developers.
Pete Starkey, I-Connect007
A two-year project funded by an Innovate UK SMART Grant aims to reduce the impact of e-waste using naturally derived, biodegradable and nontoxic products. Those attending the webinar for the Institute of Circuit Technology’s annual meeting on March 2 learned more about the project, as well as statutory paperwork obligations of the UK REACH regulations. Following the formal business, ICT Chair Emma Hudson introduced and moderated this technical webinar.