Ventec Completes Launch on Taiwan Stock Exchange


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Ventec International Group Co., announces the successful completion of its public listing on the Taiwan Stock Exchange.

The official red-carpet ceremony to mark the opening of the Taiwan Stock Exchange and the beginning of trading in Ventec shares was officiated on April 17, 2019 by Ventec Board Chair Tony Lau, CEO Jason Chung and CFO Jennifer Tu. The shares are listed under the Stock Code 6672 and name Ventec.

Ventec_TSE.jpg

"Today's listing is an important milestone for Ventec," commented Tony Lau. "It allows us to continue to pursue our ambitious and agile growth strategy that not only keeps pace with, but also drives the rapidly changing dynamics and technology of our marketplace."

Jason Chung added: "I'm delighted with the overwhelming reception our listing has received. We've witnessed extraordinarily strong interest and a very positive reaction from investors to our company. The groundwork for this achievement is laid by our strong and dedicated global team, providing Ventec with a firm base for our ambitious growth targets."

About Ventec International Group

Ventec International is a premier supplier to the Global PCB industry. With volume manufacturing facilities in Taiwan and China and distribution locations and manufacturing sites in both the US and Europe, Ventec specializes in advanced copper clad glass reinforced and metal backed substrates. Ventec materials, which include high-quality enhanced FR4, high-speed/low-loss- & high-performance IMS material technology and an advanced range of thermal management solutions, are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015, and are backed by a fully controlled and managed global supply chain, sales- and technical support-network. For more information, visit www.venteclaminates.com.

Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates

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