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Ventec International, a supplier of copper clad laminates (CCL), is poised to reap fruits from deployments in developing 5G and niche products, Digitimes reports.
Company president Jason Chung said that Ventec's revenue performance will improve quarter by quarter in 2019, with shipments of special PCB materials, in particular, to grow significantly.
Chung said that by leveraging its patented formula and special process technology, Ventec has developed lead-free, halogen-free and heat-resistance substrates, heat-dissipation aluminum substrates that have been validated by leading international automakers, and polyimine substrates already certified by National Aeronautics and Space Administration (NASA) of the US and aviation firms. He continued that Ventec is also developing niche-type substrates bearing high unit prices and gross margins and suitable for small-volume production.
Digitimes also reported that Ventec is developing high-frequency and high-speed materials for applications to 5G base stations, switches, and antennas, which are pending validations by potential clients.
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