CCL Firm Ventec Poised to Grab 5G Opportunities

Reading time ( words)

Ventec International, a supplier of copper clad laminates (CCL), is poised to reap fruits from deployments in developing 5G and niche products, Digitimes reports.

Company president Jason Chung said that Ventec's revenue performance will improve quarter by quarter in 2019, with shipments of special PCB materials, in particular, to grow significantly.

Chung said that by leveraging its patented formula and special process technology, Ventec has developed lead-free, halogen-free and heat-resistance substrates, heat-dissipation aluminum substrates that have been validated by leading international automakers, and polyimine substrates already certified by National Aeronautics and Space Administration (NASA) of the US and aviation firms. He continued that Ventec is also developing niche-type substrates bearing high unit prices and gross margins and suitable for small-volume production.

Digitimes also reported that Ventec is developing high-frequency and high-speed materials for applications to 5G base stations, switches, and antennas, which are pending validations by potential clients.

Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates



Suggested Items

iNEMI’s PCB Roadmap Explained

05/01/2020 | Pete Starkey, I-Connect007
In an informative and enlightening webinar, iNEMI Project Manager Steve Payne was joined by Isola Group CTO Ed Kelley to explain, review, and discuss the details of the recently published “iNEMI 2019 Roadmap for Organic PCBs.” Pete Starkey provides an overview.

Improving Copper Distribution in Pattern Plating Using Simulation Software

04/28/2020 | Pete Starkey, I-Connect007
Technical Editor Pete Starkey had the opportunity to sit in on a webinar presented by Robrecht Belis, manager of the surface finishing business unit at Elsyca—a Belgian company specialising in the simulation of electrochemical processes.

IPC Europe Shares Technical Education and Standards Awareness

04/22/2020 | Pete Starkey, I-Connect007
Against a background of COVID-19 uncertainty and unprecedented challenges, but recognizing the vital importance of continuing to educate engineers and share the knowledge and skills required to manufacture boards and assemblies of the highest yields and reliability, the IPC Europe team hosted a technical webinar for the European electronics industry, featuring the expertise of two of I-Connect007’s regular columnists: Mike Carano and Jan Pedersen. Pete Starkey provides an overview.

Copyright © 2020 I-Connect007. All rights reserved.