Continental Leverages Schweizer, Infineon Tech for 48V Systems


Reading time ( words)

Schweizer Electronic AG and Infineon Technologies AG have developed a new technology for the mild-hybridization of cars: chip embedding for Power MOSFETs. It will significantly improve the performance of 48-Volt systems while reducing their complexity. Continental Powertrain will be the first player to adopt the technology.

“Embedding Power MOSFETs will open a new chapter of possibilities for the electrification of mild hybrid cars,” said Dr. Rolf Merte, CEO at Schweizer Electronic. “The fact that one of the world’s leading automotive suppliers has chosen our technology confirms its potential.”

With chip embedding, the Power MOSFETs are no longer soldered onto a circuit board but integrated within. ”The resulting thermal benefits allow a higher power density and board integration enables further improvements in system reliability” said Dr. Frank Findeis, who is heading Infineon’s automotive MOSFET business. “These advantages result in higher power or more cost effective 48 V systems.”

As a first application, Continental Powertrain has decided to implement the new technology in a 48 V starter generator for vehicles from a major European carmaker. “Chip embedding allows us to increase electrical power by 60% compared to a traditionally designed system,” said Dietmar Vogt, System Technical Project Leader at Continental Powertrain.

48 V starter generators are a key contributor to the CO2 reduction of up to about 15% achieved by a mild hybrid vehicle compared to a conventional drive train. They allow the engine to be stopped more often and for a longer duration than a 12 V based start-stop system. Furthermore they can boost acceleration and thus reduce load on the combustion engine. During braking they recover more of the kinetic energy than a 12 V system.

Infineon contributes its leading MOSFET technology OptiMOS 5 to the new approach, Schweizer its embedding power PCB technology called Smart p² Pack. The partners plan to start mass production in 2021.

About Schweizer

Schweizer Electronic AG stands for state-of-the-art technology and consultancy competence. Schweizer’s premium printed circuit boards and innovative solutions and services for automotive, solar, industry and aviation electronics address key challenges in the areas of power electronics, embedding and system cost reduction.

Its products are distinguished for their superior quality and their energy-saving and environmentally friendly features. Together with its partners WUS Printed Circuit (Kunshan) Co., Ltd., Meiko Electronics Co. Ltd. and Elekonta Marek GmbH & Co. KG the company offers in its division electronics cost- and production optimized solutions for small, medium and large series. Together with its partner Infineon Technologies AG, SCHWEIZER plans to jointly tap the chip embedding market in future.

 

Share

Print


Suggested Items

The Advantages of Non-sludge Acid Copper Products

09/04/2019 | Barry Matties, I-Connect007
Mike Wood, technical director with Cerambus Asia Pacific, discusses the acid copper product from Cerambus Technology Inc. that doesn't generate sludge during the plating process and operates at higher production output by using higher current density. He talks about why this is important for the state of the vertical continuous plating (VCP) market in Asia, and the trends he’s seeing in that space.

The State of Plating

09/03/2019 | Marc Ladle, Viking Test Ltd.
Increasingly, PCB design technology utilises buried and blind via holes and plated via fill is also becoming more and more common. The buried and blind holes mean that the loading on the plating equipment is multiplied by the number of different inner layer connections. The same technology means that equipment needs to deal with thinner and thinner materials.

Innovative Electroplating Processes for IC Substrates

08/27/2019 | S. Dharmarathna, S. Maddux, C. Benjamin, I. Li, W. Bowerman, K. Feng, and J. Watkowski, MacDermid Alpha Electronics Solutions
The decreasing chip scales and smaller line/spacing distances have created unique challenges for both the PCB industry and the semiconductor industry. This paper discusses innovative additive packages for direct-current copper electroplating specifically for IC substrates, which offer better trace profile and deliver via fill and through-hole plating. It also describes two electrolytic copper plating processes, the selection of which could be based on the via size and the dimple requirements of the application.



Copyright © 2019 I-Connect007. All rights reserved.