Unimicron to Pour $644 Million Into FC Substrate Biz Over 4 Years


Reading time ( words)

Unimicron Technology plans to invest a total of NT$20 billion ($644.7 million) in R&D and expanding production capacity for advanced flip-chip (FC) substrates through 2022 to tap business opportunities arising from 5G, artificial intelligence (AI) and big data, according to a Digitimes report.

The planned investment over the next four years will come from the company's own funds and bank loans, Digitimes adds. Unimicron's high-end substrate production lines are mainly in Taiwan.

Share

Print


Suggested Items

Stacked Microvia Reliability: Ongoing Work and Upcoming IPC Conference

04/24/2019 | Pete Starkey, I-Connect007
One year ago, Happy Holden's review of the 2018 IPC High-Reliability Forum reported the presentation of J.R. Strickland and Jerry Magera, who described research at MSI Applied Technology into overcoming the risk of stacked microvia failures escaping standard quality assurance procedures. Their report provided a basis for the IPC white paper IPC-WP-023, which addressed reliability issues associated with stacked microvias and included data collected from several other printed circuit manufacturers.

Smart Factories: More Than Robots

03/21/2019 | Nolan Johnson, I-Connect007
The acceptance of smart factories is a global movement across multiple industries. Even materials and chemistries are aligning with a move toward further automation, which allows equipment manufacturers to capture and store more data, and software layers to perform more detailed analysis, prediction, and optimization.

Excerpts from Prismark’s Presentation at CPCA 2018

06/29/2018 | I-Connect007
Prismark Partners LLC presented a detailed report at the recent CPCA meeting and show in Shanghai, China, on the challenges and opportunities for the PCB market. Part of the discussion was on 5G and is excerpted here with permission.



Copyright © 2019 I-Connect007. All rights reserved.