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The global HDI printed circuit board market is anticipated to reach $24.63 billion by 2025, while augmenting at a CAGR of 12.8%. The market growth is attributed to the increasing miniaturization of electronic devices, rapid inclination of consumers towards smart devices, and significant growth in consumer electronics as well as increasing adoption of safety measures in automobile. Additionally, increasing adoption of smart wearables is also likely to fuel the demand for high density interconnects PCBs over the forecast period. However, the high cost coupled with lack of expertise in manufacturing HDI printed circuit board is expected to impede the market growth to during 2019-2025.
High density interconnect PCB is an evolution in printed circuit board manufacturing technology that assists in fabricating higher circuit density than conventional PCBs. HDI printed circuit board offers an ability to place more components on both sides of the PCBs, which significantly results in faster signal transmission speed and reduction in signal loss. Moreover, it provides faster routing, minimize the frequent relocation of components, and utilize less space. Furthermore, it designs to reduce size as well as improves electrical performance of embedded devices.
Key Findings of the Report:
The global HDI printed circuit board market is expected to reach $24.63 billion by 2025, at a CAGR of 12.68%
Based on layers, 12 and above layers is estimated to register the highest CAGR over the forecast period. The segment growth is attributed to the increasing deployment of HDI printed circuit board in many applications such a mobile devices, automotive products and among others.
Based on application, smart phone and tablet segment held the major market share in 2018, and expected to retain its dominance during 2019-2025
Based on end-use, the consumer electronics segment is expected to dominate the market in 2018, whereas industrial electronics segment is likely to emerge as the fastest growing segment over the forecast period.
Prominent players operating in the HDI printed circuit board market include Unimicron Corporation; AT&S; TTM Technologies; Zhen Ding Tech; Epec, LLC.; Unitech; NCAB GROUP CORPORATION; Sierra Circuits; Millennium Circuits Limited; and Mistral Solutions Pvt. Ltd. among others.
Rapid Deployment of High Density Interconnect PCB Across Various End-Use Industries
The substantial increase in the sales of consumer electronics along with the growing demand for high density printed circuit boards in many end-use applications is likely to foster the market growth. Additionally, lightweight and high performance of HDI printed circuit boards is making them suitable for powering wearable devices. Besides, HDI printed circuit board utilizes a combination of advanced features such as blind vias, and microvias among others to maximize the space of the board while increasing its performance and functionality. Furthermore, increasing trend towards autonomous driving and sophisticated safety systems is creating more opportunity for the demand over the forecast period.
Global High Density Interconnect PCB - Regional Insight
Geographically, the global HDI printed circuit boards market is segmented into North America, Asia-Pacific, Europe, Middle East and Africa, and Central & South America. North America is accounted to hold the largest market share in 2018, owing to increased adoption of smart wearables coupled with rising demand for HDI printed circuit boards from automotive sector. However, Asia-Pacific is likely to emerge as the fastest growing region in the HDI printed circuit board market, and anticipated to dominate the market during 2019-2025. The presence of major electronics and semiconductor manufacturers and rapid expansion of telecommunication network in emerging economies is estimated to augment the market growth during the forecast period.