TFE Adds Hayes Myers as Customer Relations & Tech Support Manager


Reading time ( words)

TFE has recently added Hayes Myers to its team as customer relations and technical support manager.  Hayes has over 22 years of experience in both manufacturing and new product introduction/engineering in the printed circuit board industry. Hayes brings a broad range of technology and materials experience, along with a strong knowledge of the requirements of IPC and mil/aerospace products, to the TFE team.

"I look forward to working with all of TFE's clients to develop technical solutions and continue the building of strong relationships,” said Myers.

About TFE

TFE distributes capital equipment from the best manufacturers in the world as well as a wide range of replacement parts required for all phases of machine life cycle maintenance.

With the rise of LED technology, the PCB industry has seen an increased demand for metal core printed circuit boards for thermal management. To service this demand TFE has partnered with Aismalibar to represent their products in North America. We stock a wide range of copper clad laminates to help our customers capitalize on this rapidly expanding market.

TFE also provides a full range of consumable materials for printed circuit board manufacturing with inventories of high-quality carbide and diamond tools available for high priority jobs on short lead-time. TFE is the exclusive distributor of HPTec tools, imported from Germany, in North America.

Share

Print


Suggested Items

ICT 45th Annual Symposium Review

06/12/2019 | Pete Starkey, I-Connect007
The Institute of Circuit Technology (ICT) held its 45th annual symposium on June 4, 2019 in Dudley at the Black Country Museum—a symbol of the spirit of innovation in engineering technology and the entrepreneurial and manufacturing skills that had established that region’s supremacy in leading the original Industrial Revolution. Here's a recap of the events and presentations at the symposium.

DuPont on Materials Challenges and New Opportunities

06/11/2019 | I-Connect007 Editorial Team
John Andresakis, senior marketing technologist in the Interconnect Solutions (ICS) Group of DuPont, and Jonathan Weldon, RF applications engineer also in ICS at DuPont, spoke with the I-Connect007 editorial team about trends the company is seeing, what challenges their customers are facing with materials today, and future opportunities with new technologies, including 5G, electric cars, IoT, and more.

Creating Stability in Materials Chaos

06/06/2019 | Nolan Johnson, I-Connect007
Nolan Johnson and Tony Senese—manager, business development group, Panasonic EMBD—discuss the evolution of the materials marketplace over the years from a time when the market aligned for the rise of Panasonic’s MEGTRON 6 to the ever-changing materials industry of today. With the ramp-up to 5G and everyone pushing product development, Tony describes a chaotic materials market flooded with new companies and materials.



Copyright © 2019 I-Connect007. All rights reserved.