Taiyo America Names New President


Reading time ( words)

With the relocation due to his term as director and president ending, Taiyo America, Inc.’s Tadahiko Hanada has been transferred to the position of general manager, FPC Materials Department at Taiyo Ink Japan, effective May 1, 2019.

To fill the open executive position at Taiyo America, Inc. in Carson City NV, Takuji “Zach” Maekawa has been appointed as the new president. His impressive qualifications and dimension as an executive leader will elevate Taiyo into another stratosphere, allowing customers, distributors and OEMs alike to reach technological places not attained before now. In order to achieve these targeted aspirations, Maekawa shared that, “I am excited to join such a successful team at Taiyo America and look forward to helping grow their business in Europe and open new markets in North America."

Maekawa’s experience in industrial precision manufacturing and high growth internet technology at companies in the US, Japan and Asia, as well as his education, an Electrical Engineering degree and an MBA from Cornell University, placed him at the pinnacle of Taiyo’s candidate list. Taiyo America BOD member, John Fix states that, “Maekawa brings a new dimension to Taiyo America with regard to his vast experience in new technologies and growth companies."

Regarding Taiyo America’s current and future strategy, Zach stated that, “Taiyo has an excellent core business in that we are the market leader in solder mask, so we plan to take it to the next level."

About Taiyo America, Inc.

Established over 29 years ago TAIYO AMERICA, INC. is a subsidiary of TAIYO HOLDINGS CO., LTD., the world's leading manufacturer of specialty inks and solder masks for printed circuit boards. Taiyo offers conductive inks for manufacturing printed electronics, lighting & displays, and other applications.

For more information, visit www.taiyo-america.com.

Share

Print


Suggested Items

Benchmarking Your Process Engineering

04/29/2021 | I-Connect007 Editorial Team
Mark Thompson has been in bare board fabrication for over 30 years. He is now laying out printed circuit boards at Monsoon Solutions, a high-tech design bureau near Seattle, Washington. With Mark’s extensive hands-on knowledge of PCB manufacturing, he brings a unique perspective to PCB design. In this discussion with the I-Connect007 editorial team, Mark shares what’s important from a process engineer’s point of view, and how to stay on top of evaluating and benchmarking your manufacturing process, along with insights from his new role as a designer.

EIPC Technical Snapshot: 5G and Loss Minimisation

03/26/2021 | Pete Starkey, I-Connect007
Bringing a specialised technical area into sharp focus, this month’s topic was “5G and the understanding of loss minimisation at the PCB level,” with papers on dielectric material, copper foil, and modelling solutions. The webinar was moderated by EIPC board member Paul Waldner managing director of Multiline International Europa, who admitted that he had managed to get a haircut especially for the occasion!

PCB Requirements for E-Mobility

03/23/2021 | I-Connect007 Editorial Team
Nolan Johnson, Barry Matties, and Happy Holden speak with Christian Klein, section manager for PCBs in the automotive electronics division, about Bosch’s recent presentation on PCB requirements of the future in regard to automotive and electro mobility trends and challenges.



Copyright © 2021 I-Connect007. All rights reserved.