NPL Webinar on Effect of Bias on CAF Failures of Electronic Circuits


Reading time ( words)

High reliability in service is the key issue in today’s high-density electronic circuits. And the voltage applied to the electronic circuit plays a very important role in electrochemical reliability. Insulation resistance (IR) measurement has been widely used to predict and evaluate the reliability of electronic circuit. But the test voltages for existing IR measurement are only up to 300V. With the trend toward more electric vehicles, measurements need to be conducted at significantly increased voltages to understand potential new failure mechanism when using voltages up to 1,000V.

In line with this, the National Physical Laboratory will hold a webinar on July 16, 2019 to help the industry understand the effect of bias (up to 1,000V) on conductive anodic filament (CAF) failures of electronic circuits. For this webinar, NPL has commissioned a 1,000V IR test facility for demonstration.

For more information or to register, click here.

Share

Print


Suggested Items

Institute of Circuit Technology Spring Seminar 2020

03/11/2020 | Pete Starkey, I-Connect007
Back to Meriden, the nominal centre of England where the daffodils were blooming. A good crowd made it to the spring seminar that followed the Annual General Meeting of the Institute of Circuit Technology (ICT), with five specialist presentations and excellent opportunities to network with their peers in the industry. Pete Starkey shares his overview of the event.

How to Become a Certified IPC Trainer

12/27/2019 | Blackfox Training Institiute
The Blackfox Certified IPC Trainer (CIT) programs are best suited for experienced and skilled electronics technicians, engineers, and supervisors who have the will and passion to teach and train colleagues about the quality standards of IPC. They also provide successful candidates with a credential that confirms their knowledge and understanding of IPC quality systems.

Electrolytic Plating: Filling Vias and Through-holes

05/28/2019 | M. Özkök, S. Lamprecht, A. Özkök, D. Akingbohungbe, and M. Dreiza, Atotech Deutschland Gmbh; and A. Stepinski, Greensource Fabrication
The continuously evolving electronics industry environment is causing the development of various electrolytic copper processes for different applications over the past several decades. This article describes the reasons for development and a roadmap of dimensions for copper-filled through-holes, microvias, and other copper-plated structures on PCBs.



Copyright © 2020 I-Connect007. All rights reserved.