IPC APEX EXPO 2020 Deadline for Papers: June 21


Reading time ( words)

IPC APEX EXPO is the electronics industry's premier technical conference and exhibition, drawing an international audience to experience the latest advancements in design, materials, assembly, processes, inspection, and equipment. Areas of interest are diverse and ever-changing to keep up with the pace of innovation. 

Presenting at IPC APEX EXPO provides visibility for you and your organization. The proceedings from the technical conference reach an audience of thousands and are regarded as the best place to follow current technologies and best practices. Your material will be seen by key managers and executives from all segments of the worldwide electronics industry. To recognize exceptional achievement, awards will be presented for "Best Paper."

Presenters from companies such as Ericsson AB, Flextronics, IBM Corporation, Indium Corporation, MacDermid-Enthone, Northrop Grumman Corporation, Oracle Corporation and Robert Bosch GmbH have published papers at previous technical conference sessions at IPC APEX EXPO.

Professional development courses are also a great way to delve deeper into the challenges facing the electronics industry. Instructors of these courses have the largest potential audience and reach a wide swath of attendees focused on learning. This is also a great way to pass on knowledge based on years of experience and leave a legacy.

Technical Conference

Provide an abstract of approximately 300 words that summarizes technical work, covering case histories, research and discoveries. Authors of papers selected for the conference will each receive a detailed speaker manual to assist them with numerous items, including the formatting of their papers and presentation slides.

Conference Paper Timeline: Abstracts due June 21, 2019

Professional Development Courses

Course proposals are solicited from individuals interested in teaching half-day (three-hour) professional development courses on design, manufacturing processes, materials, supply chain and reliability. Travel expenses and honorariums are offered to professional development instructors.

Professional Development Timeline: Proposals due June 24, 2019

For more information on topics, speaker benefits and speaker recognition awards, please visit ipcapexexpo2020.ipc.org/cfp.

Share

Print


Suggested Items

EPA, Industry Come Together in Visit to TTM Facility

07/18/2019 | Kelly Scanlon, director, EHS policy and research
IPC member TTM Technologies is proud to show off the new wastewater-treatment system at its Sterling, Virginia plant, which is helping to enhance the company’s pollution prevention and resource recovery performance.

Microvias: Links of Faith are Not Created Equally

07/18/2019 | Jerry Magera and J.R. Strickland, Motorola Solutions Inc.
Microvias connect adjacent copper layers to complete electrical paths. There are copper-filled microvias, which can be stacked to form connections beyond adjacent copper layers, and staggered microvias, which stitch adjacent copper layers with paths that meander on the layers between the microvias. This article discusses the various laser-drilled microvias and presents SEM photographs to begin the search for the root cause of weak copper interface.

Dissecting the IPC Regional Survey on PCB Technology Trends

07/15/2019 | I-Connect007 Editorial Team
Sharon Starr, Denny Fritz, and Mike Carano talk about the global 2018 IPC Technology Trends Report released early this year—the size of the survey, how it was conducted, the general findings, and regional differences. They also shared their takeaways and regional insights, and the industry outlook over the next five to 10 years.



Copyright © 2019 I-Connect007. All rights reserved.