AT&S Marks 20th Anniversary of IPO


Reading time ( words)

AT&S has just achieved two significant milestones: On the one hand, the company is the globally leading supplier of high-end printed circuit boards, according to the figures of the industry expert Prismark for 2018. On the other hand, AT&S is celebrating its successful initial public offering (IPO) 20 years ago and its equally positive development over two decades.

Ever more complex, high-density interconnect (HDI) and powerful systems with the corresponding electronic circuits require printed circuit boards designed to meet these needs. These requirements are addressed with high-end products such as HDI technology. Such technologies offer advantages, including higher circuit density, better characteristics for electrical behaviour and signal transmission, short signal paths and good electromagnetic compatibility (EMC) and interference immunity, making the high-quality products more powerful, more reliable, lighter and more compact. Typical applications include smartphones, tablets, wearables, automotive and storage products, industrial electronics, but also future 5G applications.

However, these high-end technologies place increased demands on design and manufacturing. This is where AT&S contributes its extensive know-how, combined with its high research and development performance and an early strategic focus on high-quality and highly advanced products. The market researchers of Prismark see AT&S as the number one company in the HDI market segment in 2018 with a share of more than US$830 million. HDI products account for roughly 15% of the entire global printed circuit board market.

20 Years Since IPO

The leading position of AT&S for HDI printed circuit boards underpins the strategic orientation focusing on high-end products. AT&S offers a wide range of advanced solutions for customers in the mobile devices, automotive electronics, medical technology, industrial electronics and semiconductor industries. Against this background, AT&S not only carried out a successful IPO, but recorded an equally successful company development with a continuous dividend policy for its shareholders. Since the IPO, revenue increased from € 151 million (end of 1998/99) to more than €1 billion, and the headcount rose from roughly 1,900 (end of 1998/99) to 9,800.

The initial public offering of AT&S took place in the Neuer Markt segment in Frankfurt in July 1999, thus celebrating its 20-year anniversary. In spring 2008 the decision was made to transfer to the Vienna Stock Exchange. At the same time, the termination of the listing and the revocation of the admission of AT&S shares to the Regulated Market at the Frankfurt Stock Exchange were initiated. On the Vienna Stock Exchange the share has been a member of the ATX index since March 2018.

AT&S will continue to develop and offer powerful solutions for the growing demands in dynamic markets such as e-mobility, automated/autonomous driving, 5G mobile communication, modern medical technology and the semiconductor industry in the future. At the same time, the company is undergoing a transformation to become a provider of comprehensive interconnect solutions with products and technologies that go far beyond pure printed circuit boards. This is considered a great opportunity to evolve fundamentally on different levels in order to reach a significantly larger market with high global growth rates. Customers can be served on an even broader basis with higher value creation potential while new areas of application can be opened up. To this end, AT&S uses its existing expertise and technologies, expanding them with appropriate investments.

About AT&S

AT&S is the European market leader and one of the globally leading manufacturers of high-value printed circuit boards and IC substrates. AT&S industrialises leading-edge technologies for its core business segments Mobile Devices, Automotive, Industrial, Medical and Advanced Packaging. AT&S has a global presence, with production facilities in Austria (Leoben and Fehring) and plants in India (Nanjangud), China (Shanghai, Chongqing) and Korea (Ansan, near Seoul). The company employed an average of about 10,000 people in the financial year 2017/18. For more information: www.ats.net

Share




Suggested Items

Material Application for Mini Backlight Unit

04/12/2022 | Aaron Chen, Wazam New Material Co. Ltd.
In 1980, about 90% of the materials used to make PCBs was FR-4. As time went by, technology developed, and electronic devices relentlessly integrated into every area of our lives. The constant acceleration of upgrading meant endless challenges and opportunities for CCL suppliers. Wazam New Material Co. Ltd. is a CCL supplier that strives to be attentive to the needs of its end customers and provide comprehensive solutions. One example is the mini backlight unity (MBLU) application material.

Institute of Circuit Technology: A Novel Approach to Recycling PCBs

03/10/2022 | Pete Starkey, I-Connect007
A two-year project funded by an Innovate UK SMART Grant aims to reduce the impact of e-waste using naturally derived, biodegradable and nontoxic products. Those attending the webinar for the Institute of Circuit Technology’s annual meeting on March 2 learned more about the project, as well as statutory paperwork obligations of the UK REACH regulations. Following the formal business, ICT Chair Emma Hudson introduced and moderated this technical webinar.

Catching Up With RBP Chemical and Schlötter

01/20/2022 | Dan Beaulieu, D.B. Management Group
It’s always great to see two very good companies form a mutually beneficial alliance. I was lucky enough to watch this particular strategic partnership come to fruition this year between RBP Chemical and Schlötter. I wanted to talk to both companies, so I sat down with Matthias Hampel, global executive representative-PCB and electronics at Schlötter, and Ernest Litynski, president of RBP Chemical Technology, to get the inside story.



Copyright © 2022 I-Connect007. All rights reserved.