July 2019 Issue of PCB007 Magazine Available Now


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Our industry is embarking on a new age of technical development to achieve much higher levels of overall reliability that will be required of the devices we fabricate. Medical devices will be relied upon to keep us living in many more situations. Autonomous vehicles will need to be failure-free to keep riders and pedestrians alike safe in the world. IoT will bring opportunities to put smart electronics in new places, performing unthought-of ways.

This month's issue of PCB007 Magazine highlights why reliability will be crucial to both our success and safety.

This July 2019 issue of PCB007 Magazine is now on the virtual newsstand, and available for delivery in your e-mailbox each month.

Subscribe through your my I-Connect007 membership.

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A Guide to High-reliability PCBs from Design to Specification

07/24/2019 | Jeff Beauchamp, NCAB Group
Creating reliable PCBs is an outcome of considering all aspects that can affect reliability as early as possible in the design process. The further down the design process, the more expensive and risky it can be to fix. As they say, everything starts with the design. Because a good board design improves the reliability of the end product and lessens the risk of failure.

Reliability... It All Comes Down to the Landing

07/17/2019 | Nolan Johnson, I-Connect007
Our industry is embarking on a new age of technical development to achieve much higher levels of overall reliability that will be required of the devices we fabricate. Whether in medical devices, autonomous vehicles, or in IoT, reliability will be crucial to both our success and safety.

Stacked Microvia Reliability: Ongoing Work and Upcoming IPC Conference

04/24/2019 | Pete Starkey, I-Connect007
One year ago, Happy Holden's review of the 2018 IPC High-Reliability Forum reported the presentation of J.R. Strickland and Jerry Magera, who described research at MSI Applied Technology into overcoming the risk of stacked microvia failures escaping standard quality assurance procedures. Their report provided a basis for the IPC white paper IPC-WP-023, which addressed reliability issues associated with stacked microvias and included data collected from several other printed circuit manufacturers.



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