-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
iNEMI Publishes Additional Chapters from the 2019 Roadmap
July 25, 2019 | iNEMIEstimated reading time: 3 minutes
The International Electronics Manufacturing Initiative (iNEMI) has announced release of four additional chapters from its 2019 Roadmap. The latest chapters now available online are: mass data storage, MEMS & sensors, optoelectronics, and semiconductor technology.
iNEMI’s roadmap is a global collaborative effort, developed by subject matter experts from all perspectives of the electronics manufacturing supply chain, including manufacturers, suppliers, consortia, government agencies and universities. Individuals from these diverse organizations share their expertise to help define the technology needs of key market segments by focusing on the market demands and functionality requirements of those segments. They also identify key technology developments anticipated and required within the supply chain to meet product needs between now and 2029.
Chapter Highlights
Mass Data Storage — This chapter presents a comprehensive assessment of the historical and current state of mass data storage products along with promising means of increasing optical storage capacity in the future. It highlights such data storage trends as the migration of solid state/flash storage to 3D architectures, and reduced volume of hard disk drives (HDDs) due to stagnant IT spending, the migration from client/server to mobile/cloud systems, and higher utilization of HDD capacity. It includes updates and forecasts on trends in areas such as MRAM (magnetic random access memory) and SCM (storage class memory) technologies, as well as updates on developments in cost-effective tape storage solutions and evolving optical storage applications.
MEMS & Sensors — The 2019 MEMS and Sensors roadmap chapter focuses on several evolving application areas that are driving developments for such devices. As sensing capabilities move from standalone sensors to being integrated into system solutions they are being deployed across more diverse market applications. The need for trillions of sensors in applications such as wearables is also driving the industry toward hybrid flexible electronics, where silicon-based sensors are integrated on a flexible electronics platform and widely deployed. The chapter discusses the need for developing and improving capabilities in design, supply chains, diverse manufacturing, and testing to ensure reliable and secure performance in a myriad of applications, from agricultural monitoring to autonomous driving. It also addresses the shift to increasing sensing and analysis requirements at the Internet of Things edge (IoTe). A summary of technology needs for the next 10 years for the industry in representative application areas are presented.
Optoelectronics — As Internet traffic and the number of connected devices increase, larger volumes of data are produced, which continues to fuel optical technology development. The 2019 Optoelectronics chapter comprehensively addresses all aspects of data transmission that utilize optical technologies across distances of thousands of kilometers down to a few millimeters (on-chip) — including free-space optical communication used, for example, between spacecraft over interplanetary distances. As data rates rise in applications, optical technology continues to displace copper for data transmission. The 2019 Optoelectronics roadmap refreshes the chapter to the current situation for these various applications of optoelectronics and details the critical technical challenges that must be overcome to meet this demand. It also highlights the critical research and development needs in terms of manufacturing capabilities development and materials innovation, as well as identifying new areas of innovation that will be explored by research and industry over the next 10 years.
Semiconductor Technologies — The advent of fabless design houses and foundries has revolutionized the way in which business is done in the semiconductor industry with the needs of the products in key markets now driving integrated circuit (IC) device development. For example, no longer does a faster microprocessor trigger the design of a new PC. Instead, the design of a new smart phone generates the requirements for new ICs. In addition, fast-approaching fundamental 2D topological limits have impacted the ability of the semiconductor industry to continue scaling at historical rates. New, creative 3D transistors, memory cells, and overall IC structures are revolutionizing the way ICs are designed and manufactured. The 2019 Semiconductor Technologies chapter summarizes some of the major system characteristics in cloud computing, mobile, IoT, cyber-physical systems, plus the major technology characteristics of logic and memory devices.
About iNEMI
The International Electronics Manufacturing Initiative’s mission is to forecast and accelerate improvements in the electronics manufacturing industry for a sustainable future. The consortium is made up of more than 90 manufacturers, suppliers, industry associations and consortia, government agencies, research institutes and universities. iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, executes collaborative projects to eliminate these gaps (both business and technical) and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government agencies, universities and other funding agencies to set priorities for future industry needs and R&D initiatives. iNEMI is based in Morrisville, North Carolina. For additional information about iNEMI, visit http://www.inemi.org.
Suggested Items
iNEMI Webinar: Humidity Robustness and Insulation Coordination for e-Mobility
03/27/2024 | iNEMIThis webinar is a follow-up to the recent Seminar on Humidity Robustness and Insulation Coordination for e-Mobility, organized by iNEMI and ZESTRON Europe and supported by the ECPE.
Electronics Industry Sentiment Rises in March
03/27/2024 | IPCIPC releases March 2024 Global Sentiment of the Electronics Supply Chain Report
Mycronic to Showcase More Versatile, High-productivity Assembly Solutions at IPC APEX EXPO 2024
03/27/2024 | MycronicMycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect PCB assembly at IPC APEX EXPO 2024 in Anaheim, CA on April 9 - 11.
Don Dennison Appointed to Roll Out KIC’s Latest Thermal Analysis System Software in the Northeast
03/26/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is pleased to announce the appointment of PIT Equipment Services, LLC, led by Don Dennison, as its representative for New York, New Jersey, and Eastern Pennsylvania.
The Many Complexities of PFAS
03/26/2024 | Marcy LaRont, PCB007 MagazineIn its simplest definition, PFAS is a group of chemicals used to make fluoropolymer coatings and products that resist heat, oil, stains, grease, and water. Fluoropolymer coatings can be in a variety of products. Though this definition is not inaccurate, it can be misleading. Depending on who you ask, there are upward of 10,000 PFAS chemistries that can meet various definitions.